MIND-IN2UB, Department of Electronics, Universitat de Barcelona, Martí i Franquès 1, 08028 Barcelona, Spain.
J Chromatogr A. 2010 Sep 10;1217(37):5817-21. doi: 10.1016/j.chroma.2010.07.057. Epub 2010 Jul 30.
An experimental study of a micromachined non-porous pillar array column performance under non-retentive conditions is presented. The same pillar structure has been fabricated in cyclo-olefin polymer (COP) chips with three different depths via hot embossing and pressure-assisted thermal bonding. The influence of the depth on the band broadening along with the already known contribution arising from the top and bottom cover plates has been studied. The experimental results exhibit reduced plate heights as low as 0.2, which are in agreement with the previous experimental work. Moreover, the constant values of the reduced Van Deemter expression are also in accordance with the previous studies. A more exhaustive study of the C-term band broadening is also presented, showing that comparing the space between the pillars with different open tubular rectangular channels offers a good estimation of the C-term band broadening that is obtained experimentally. These experimental results, hence, confirm that micromachined pillar array columns fabricated in COP can achieve the same performance as the ones fabricated in silicon for the presently studied pillar channel design.
本文介绍了在非保留条件下，微机械无孔柱状阵列柱性能的实验研究。通过热压印和压力辅助热键合，在环烯烃聚合物 (COP) 芯片上制造了具有三种不同深度的相同柱状结构。研究了深度对带展宽的影响，以及已经知道的来自顶部和底部盖板的贡献。实验结果表明，板高降低到 0.2，这与之前的实验工作一致。此外，简化的范德米尔表达式的常数也与之前的研究一致。还对 C 项带展宽进行了更详尽的研究，表明比较不同开管矩形通道之间的柱空间可以很好地估计实验中获得的 C 项带展宽。因此，这些实验结果证实，用 COP 制造的微机械柱状阵列柱可以实现与目前研究的柱状通道设计中用硅制造的柱状阵列柱相同的性能。
