Department of Mechanical Engineering, University of Minnesota, 111 Church Street SE, Minneapolis, MN 55455, USA.
J Colloid Interface Sci. 2011 Feb 1;354(1):1-6. doi: 10.1016/j.jcis.2010.09.036. Epub 2010 Sep 29.
A new method has been developed for the superhydrophilic surface modification of copper using versatile solution-based fabrication techniques. The high surface area of TiO(2) nanoparticles was exploited to create a thin film with increased surface energy that transformed copper materials from relatively hydrophobic to superhydrophilic. Copper exposed to ambient conditions resulting in a thin layer of copper oxide has a water contact angle near 90°, but following TiO(2) modification, the contact angle dropped to 0°. The thin film responsible for this drastic improvement in wettability proved durable by retaining its excellent properties throughout an extended application of thermal stress. SEM and Raman Spectroscopic analysis confirmed the structural integrity of the film before and after a durability test.
已经开发出一种新方法，通过多功能溶液基制造技术对铜进行超亲水表面改性。利用 TiO(2)纳米粒子的大表面积，制造出具有增加的表面能的薄膜，将铜材料从相对疏水转变为超亲水。暴露于环境条件下的铜会导致形成一层薄的氧化铜，其水接触角接近 90°，但经过 TiO(2)改性后，接触角降至 0°。这种薄膜在热应力的长时间应用中仍然保持其优异的性能，从而证明其对润湿性的显著改善具有耐用性。SEM 和拉曼光谱分析证实了薄膜在耐久性测试前后的结构完整性。
