Department of Chemical and Biomolecular Engineering, Sogang University, 1 Sinsu-dong Mapo-gu, Seoul, 121-742, South Korea.
ACS Appl Mater Interfaces. 2010 Nov;2(11):2982-6. doi: 10.1021/am100773h. Epub 2010 Nov 9.
We fabricated three-dimensional copper oxide structure by holographic lithography and electroless deposition. A five-beam interference pattern defined a woodpile structure of SU-8. The surface modification of SU-8 structure was achieved by multilayer coating of polyelectrolyte, which is critical for activating the surface for the reduction of copper. Copper was deposited onto the surface of the structure by electroless deposition, and subsequent calcinations removed the SU-8 structure and simultaneously oxidized the copper into copper oxide. The porous copper oxide structure was used as a photoelectrochemical electrode. Because of the highly porous structure, our structure showed higher photocurrent efficiency.
我们通过全息光刻和化学镀制备了三维氧化铜结构。五光束干涉图案定义了 SU-8 的木堆结构。通过聚电解质的多层涂层实现了 SU-8 结构的表面改性，这对于激活表面以进行铜还原至关重要。通过化学镀将铜沉积到结构表面上，随后的煅烧去除了 SU-8 结构，同时将铜氧化成氧化铜。多孔氧化铜结构用作光电化学电极。由于其高多孔结构，我们的结构表现出更高的光电流效率。
