Wu Chun-Chang, Hsu Steve Lien-Chung, Lo I Lin
Department of Materials Science and Engineering, Center for Micro/Nano Science and Technology, National Cheng-Kung University, Tainan 701-01, Taiwan, ROC.
J Nanosci Nanotechnol. 2010 Oct;10(10):6446-52. doi: 10.1166/jnn.2010.2618.
In this work, we have developed low-cost, high modulus, flexible, and UV transparent polyimide plastic molds for nanoimprint lithography (NIL). Different structures of poly(amic acids) (PAA) and polyimides (PI) have been synthesized. By casting the PAA or PI solutions on a silicon master, flexible but still rigid plastic molds can be produced. The advantages of the PI molds are: (1) high glass-transition temperatures (Tg) up to 310 degrees C, (2) high thermal stability over 500 degrees C, (3) high tensile modulus, and (4) UV transparency for use in UV-NIL. Various micrometer and nanometer scale patterns could be obtained from the PI molds on a large area (4 inch wafer). The imprinting results showed that the PI molds could be faithfully used for both hot embossing NIL and UV-NIL.
在这项工作中,我们开发了用于纳米压印光刻(NIL)的低成本、高模量、柔性且紫外线透明的聚酰亚胺塑料模具。合成了不同结构的聚酰胺酸(PAA)和聚酰亚胺(PI)。通过将PAA或PI溶液浇铸在硅母版上,可以生产出柔性但仍具刚性的塑料模具。PI模具的优点包括:(1)高达310摄氏度的高玻璃化转变温度(Tg);(2)超过500摄氏度的高热稳定性;(3)高拉伸模量;(4)用于紫外线纳米压印光刻的紫外线透明性。在大面积(4英寸晶圆)上,从PI模具可以获得各种微米和纳米尺度的图案。压印结果表明,PI模具可忠实地用于热压印纳米压印光刻和紫外线纳米压印光刻。