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全聚合物有机半导体激光芯片:并行制造与封装。

All-polymer organic semiconductor laser chips: parallel fabrication and encapsulation.

作者信息

Vannahme Christoph, Klinkhammer Sönke, Christiansen Mads Brøkner, Kolew Alexander, Kristensen Anders, Lemmer Uli, Mappes Timo

机构信息

Institute for Microstructure Technology, Karlsruhe Institute of Technology, 76128 Karlsruhe, Germany.

出版信息

Opt Express. 2010 Nov 22;18(24):24881-7. doi: 10.1364/OE.18.024881.

DOI:10.1364/OE.18.024881
PMID:21164833
Abstract

Organic semiconductor lasers are of particular interest as tunable visible laser light sources. For bringing those to market encapsulation is needed to ensure practicable lifetimes. Additionally, fabrication technologies suitable for mass production must be used. We introduce all-polymer chips comprising encapsulated distributed feedback organic semiconductor lasers. Several chips are fabricated in parallel by thermal nanoimprint of the feedback grating on 4″ wafer scale out of poly(methyl methacrylate) (PMMA) and cyclic olefin copolymer (COC). The lasers consisting of the organic semiconductor tris(8-hydroxyquinoline) aluminum (Alq3) doped with the laser dye 4-dicyanomethylene-2-methyl-6-(p-dimethylaminostyril)-4H-pyrane (DCM) are hermetically sealed by thermally bonding a polymer lid. The organic thin film is placed in a basin within the substrate and is not in direct contact to the lid. Thus, the spectral properties of the lasers are unmodified in comparison to unencapsulated lasers. Grating periods of 378 nm to 428 nm in steps of 10 nm result in lasing at wavelengths of 622 nm to 685 nm. The operational lifetime of the lasers expressed in number of pulses is improved 11-fold (PMMA) and 3-fold (COC) in comparison to unencapsulated PMMA devices.

摘要

有机半导体激光器作为可调谐可见激光光源备受关注。为了将其推向市场,需要进行封装以确保具有实用的寿命。此外,必须采用适合大规模生产的制造技术。我们介绍了包含封装分布式反馈有机半导体激光器的全聚合物芯片。通过在4英寸晶圆规模上对聚甲基丙烯酸甲酯(PMMA)和环烯烃共聚物(COC)进行反馈光栅的热纳米压印,并行制造了多个芯片。由掺杂激光染料4-二氰基亚甲基-2-甲基-6-(对二甲氨基苯乙烯基)-4H-吡喃(DCM)的有机半导体三(8-羟基喹啉)铝(Alq3)组成的激光器,通过热键合聚合物盖进行气密密封。有机薄膜放置在衬底内的一个凹槽中,不与盖子直接接触。因此,与未封装的激光器相比,激光器的光谱特性未发生改变。光栅周期从378nm到428nm,步长为10nm,导致在622nm到685nm波长处产生激光。与未封装的PMMA器件相比,以脉冲数表示的激光器工作寿命提高了11倍(PMMA)和3倍(COC)。

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