Institut für Experimentelle und Angewandte Physik, Universität Kiel, Leibnizstrasse 19, 24098 Kiel, Germany.
J Am Chem Soc. 2011 Mar 23;133(11):3772-5. doi: 10.1021/ja1115748. Epub 2011 Feb 22.
We present in situ X-ray surface diffraction studies of interface processes with data acquisition rates in the millisecond regime, using the electrochemical dissolution of Au(001) in Cl-containing solution as an example. This progress in time resolution permits monitoring of atomic-scale growth and etching processes at solid-liquid interfaces at technologically relevant rates. Au etching was found to proceed via a layer-by-layer mechanism in the entire active dissolution regime up to rates of ∼20 ML/s. Furthermore, we demonstrate that information on the lateral surface morphology and in-plane lattice strain during the electrochemical process can be obtained.
我们展示了原位 X 射线表面衍射研究界面过程的方法，该方法的数据采集速率在毫秒级范围内，以含 Cl 溶液中 Au(001) 的电化学溶解为例。时间分辨率的这一进展使得可以以与技术相关的速率监测固-液界面处原子尺度的生长和刻蚀过程。发现在整个活性溶解范围内，Au 的刻蚀以逐层机制进行，直至约 20 ML/s 的速率。此外，我们证明了在电化学过程中可以获得关于表面形貌和平面内晶格应变的信息。
