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通过二极管激光自混合干涉测量对超快激光烧蚀钻孔过程中的孔深进行高分辨率监测。

High-resolution monitoring of the hole depth during ultrafast laser ablation drilling by diode laser self-mixing interferometry.

机构信息

Dipartimento Interateneo di Fisica, Università degli Studi e Politecnico di Bari, Bari, Italy.

出版信息

Opt Lett. 2011 Mar 15;36(6):822-4. doi: 10.1364/OL.36.000822.

DOI:10.1364/OL.36.000822
PMID:21403696
Abstract

We demonstrate that diode laser self-mixing interferometry can be exploited to instantaneously measure the ablation front displacement and the laser ablation rate during ultrafast microdrilling of metals. The proof of concept was obtained using a 50-μm-thick stainless steel plate as the target, a 120 ps/110 kHz microchip fiber laser as the machining source, and an 823 nm diode laser with an integrated photodiode as the probe. The time dependence of the hole penetration depth was measured with a 0.41 µm resolution.

摘要

我们证明,二极管激光自混合干涉测量法可用于在金属的超快微钻削过程中实时测量烧蚀前沿位移和激光烧蚀率。该概念验证是使用 50μm 厚的不锈钢板作为目标、120ps/110kHz 的微芯片光纤激光器作为加工源以及集成光电二极管的 823nm 二极管激光器作为探头来实现的。孔穿透深度的时间依赖性以 0.41μm 的分辨率进行测量。

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