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通过后沉积In-Ga-Se薄层来提高Cu(In,Ga)Se2薄膜的表面带隙。

Increasing surface band gap of Cu(In,Ga)Se2 thin films by post depositing an In-Ga-Se thin layer.

作者信息

Tan Xiao-Hui, Ye Sheng-Lin, Liu Xu

机构信息

State Key Laboratory for Modern Optical Instrumentation, ZheJiang University, Hang'zhou, China.

出版信息

Opt Express. 2011 Mar 28;19(7):6609-15. doi: 10.1364/OE.19.006609.

DOI:10.1364/OE.19.006609
PMID:21451688
Abstract

We have developed a simple approach to fabricate wide band gap surface layer for Cu(In,Ga)Se2 (CIGS) thin film. The Cu depleted surface layer was reconstructed by an In-Ga-Se post deposition treatment at different temperatures, which was monitored by a light controlling method. A desirable Cu concentration in surface layer has been achieved after depositing a 80 nm thick In-Ga-Se layer at 400°C and the corresponding device performance is remarkably improved compared with device without surface modification. Additionally, the excess Cu(2-x)Se phase on the surface could also be eliminated by this method in case of high Cu/(In+Ga).

摘要

我们已经开发出一种简单的方法来制备用于铜铟镓硒(CIGS)薄膜的宽带隙表面层。通过在不同温度下进行铟-镓-硒后沉积处理来重构贫铜表面层,这一过程通过光控方法进行监测。在400°C沉积80纳米厚的铟-镓-硒层后,表面层实现了理想的铜浓度,与未进行表面改性的器件相比,相应器件的性能得到了显著改善。此外,在铜/(铟+镓)较高的情况下,该方法还可以消除表面上多余的Cu(2-x)Se相。

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