Sun C H
Department of Orthodontics, Fukuoka Dental College.
Fukuoka Shika Daigaku Gakkai Zasshi. 1990;17(4):383-99.
It is well known that the bond strength of direct bonding adhesive to etched enamel is dependent upon the formation of resin tags. So it is considered that there is a significant correlation between the bond strength and the length and shape of resin tags. However, there are very few reports on this correlation. In this study, a method of combining halogenated methacrylate and electron-probe microanalyzer (EPMA) was applied for measurement of resin tag length in order to investigate the correlation between the bond strength and resin tag length. Two experimental light cured adhesives were prepared for this study. One (CI-U) was prepared by blending microfiller (30 wt%) to the mixture of di (1-methacryloyl-oxyethyl-2-chloromethyl)-2,2,4-trimethylhexamethylene dicarbamate (50 wt%) and triethylene glycol dimethacrylate (TEGDMA: 59 wt%) and the other (Br-B) was prepared by blending microfiller (30 wt%) to the mixture of Bis-GMA (22.2 wt%), TEGDMA (65.9 wt%) and tetrabromobisphenol-A-glycidyl methacrylate (4Br-Bis GMA: 11.9 wt%). Preparation of 2%, 10%, 37%, and 60% phosphoric acid solutions, 2%, 5%, 10%, and 30% maleic acid solutions and 2%, 5%, 10%, and 30% citric acid solutions was carried out for use as etchants. The consistency and the bond strength to etched enamel for the adhesives and the amount of decalcification for the etchants were measured. The etched enamel surfaces, the resin tags on resin surfaces and the interfaces between the resin and enamel were observed with a SEM. The results were as follows: 1) The consistency of Cl-U was higher than that of Br-B. 2) The amount of decalcification was proportional to acid concentration, except for phosphoric acid solution. The amount of decalcification decreased in the order of citric acid solution, maleic acid solution and phosphoric acid solution when the concentration was 2% and 10%. 3) The SEM micrographs revealed that the enamel surface treated with the etchants containing a high concentration of acid was rougher. 4) The bond strength increased with increasing the concentration of the etchants except for the bond strength of Cl-U after being immersed in 37 degrees C water for 30 days and being thermal cycled. The bond strength for Cl-U was reduced greater than that of Br-B by long-term water immersion and thermal cycling.(ABSTRACT TRUNCATED AT 400 WORDS)
众所周知，直接粘结型粘结剂与酸蚀牙釉质之间的粘结强度取决于树脂突的形成。因此，人们认为粘结强度与树脂突的长度和形状之间存在显著相关性。然而，关于这种相关性的报道却非常少。在本研究中，为了研究粘结强度与树脂突长度之间的相关性，采用了卤代甲基丙烯酸酯与电子探针微分析仪（EPMA）相结合的方法来测量树脂突长度。本研究制备了两种实验性光固化粘结剂。一种（CI-U）是通过将微填料（30 wt%）与二（1-甲基丙烯酰氧基乙基-2-氯甲基）-2,2,4-三甲基六亚甲基二氨基甲酸酯（50 wt%）和三乙二醇二甲基丙烯酸酯（TEGDMA：59 wt%）的混合物混合制备而成，另一种（Br-B）是通过将微填料（30 wt%）与双酚A甲基丙烯酸缩水甘油酯（Bis-GMA：22.2 wt%）、TEGDMA（65.9 wt%）和四溴双酚A甲基丙烯酸缩水甘油酯（4Br-Bis GMA：11.9 wt%）的混合物混合制备而成。制备了2%、10%、37%和60%的磷酸溶液、2%、5%、10%和30%的马来酸溶液以及2%、5%、10%和30%的柠檬酸溶液用作蚀刻剂。测量了粘结剂对酸蚀牙釉质的稠度和粘结强度以及蚀刻剂的脱钙量。用扫描电子显微镜观察了酸蚀后的牙釉质表面、树脂表面的树脂突以及树脂与牙釉质之间的界面。结果如下：1）CI-U的稠度高于Br-B。2）除磷酸溶液外，脱钙量与酸浓度成正比。当浓度为2%和10%时，脱钙量按柠檬酸溶液、马来酸溶液和磷酸溶液的顺序降低。3）扫描电子显微镜照片显示，用高浓度酸的蚀刻剂处理后的牙釉质表面更粗糙。4）除CI-U在37℃水中浸泡30天并进行热循环后的粘结强度外，粘结强度随蚀刻剂浓度的增加而增加。长期水浸和热循环后，CI-U的粘结强度比Br-B降低得更多。（摘要截于400字）
