用于背光模组的高亮度混合导光板。

High luminance hybrid light guide plate for backlight module application.

作者信息

Pan Jui-Wen, Fan Chen-Wei

机构信息

Institute of Photonic System, National Chiao Tung University, Tainan City 71150, Taiwan.

出版信息

Opt Express. 2011 Oct 10;19(21):20079-87. doi: 10.1364/OE.19.020079.

DOI:10.1364/OE.19.020079

PMID:21997018

Abstract

We introduce a hybrid backlight module, which consists of a hybrid light guide plate (HLGP) and a brightness enhancement film (BEF). The HLGP comprises functions of a conventional light guide plate, a reflector, and a BEF. The HLGP allows one-dimensional rays to be collimated. We add a BEF above the HLGP, and let the crossed-dimension rays to be collimated. Comparing with the conventional edge-lit backlight module, the optical efficiency improves to 1.3-times and the on-axis luminance improves to 3.7-times by using the hybrid backlight module.

摘要

我们介绍一种混合背光模组，它由一个混合导光板（HLGP）和一个增亮膜（BEF）组成。该混合导光板兼具传统导光板、反射器和增亮膜的功能。混合导光板可使一维光线准直。我们在混合导光板上方添加一个增亮膜，使交叉维度的光线也能准直。与传统侧光式背光模组相比，使用该混合背光模组后，光学效率提高到了1.3倍，轴上亮度提高到了3.7倍。