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关于电极预处理对电化学还原脱附测定金上十二硫醇自组装单层覆盖率影响的研究。

Studies on the effect of electrode pretreatment on the coverage of self-assembled monolayers of dodecanethiol on gold by electrochemical reductive desorption determination.

机构信息

School of Chemistry and Chemical Engineering, State Key Laboratory of Coordination Chemistry, Nanjing University, Nanjing 210093, China.

出版信息

Analyst. 2011 Dec 7;136(23):5058-63. doi: 10.1039/c1an15642j. Epub 2011 Oct 25.

DOI:10.1039/c1an15642j
PMID:22025009
Abstract

This paper examines the effect of five major pretreatments on the surface coverage Γ(m) of dodecanethiol self-assembled monolayer on polycrystalline gold electrode (C(12)SH-SAMs-Au). It is based on the electrochemical reductive desorption in the alkaline solution by cyclic voltammetry (CV). The five different pretreatment methods include: aqua regia pretreatment, reductive annealed pretreatment, UV/O(3) pretreatment, piranha reagents pretreatment and simple polishing pretreatment, and then all above pretreatments following the same procedure of electrochemistry cleaning. The experimental results show that the surface coverage Γ(m) for C(12)SH-SAMs-Au by the five pretreatment methods are: aqua regia pretreatment (8.0 × 10(-10) mol cm(-2)) ~ reductive annealed pretreatment (7.8 × 10(-10) mol cm(-2)) > UV/O(3) pretreatment (5.0 × 10(-10) mol cm(-2)) ~ piranha reagents pretreatment (4.1 × 10(-10) mol cm(-2)) ~ simple polishing pretreatment (4.0 × 10(-10) mol cm(-2)). This indicates that Au surfaces pretreated by aqua regia and reductive annealing can achieve the best results, and the Γ(m) values obtained are consistent with the theoretical coverage values (Γ(m) ≈ 8.0 × 10(-10) mol cm(-2)); however, the Γ(m) values for other three pretreatment methods (UV/O(3), piranha reagents and simple polishing) are not satisfactory, obtaining only almost half of the theoretical Γ(m) value. Thus, we recommend aqua regia and reductive annealed pretreatments as the best methods for self-assembling the alkyl thiol monolayer (C(n)SH-SAMs-Au), whereas UV/O(3), piranha reagents and simple polishing pretreatments are not recommended.

摘要

本文研究了五种主要预处理方法对多晶金电极(C(12)SH-SAMs-Au)上十二硫醇自组装单层表面覆盖率Γ(m)的影响。这是基于循环伏安法(CV)在碱性溶液中的电化学还原解吸。五种不同的预处理方法包括:王水预处理、还原退火预处理、UV/O(3)预处理、过硫酸氢钾预处理和简单抛光预处理,然后所有上述预处理都遵循相同的电化学清洗程序。实验结果表明,五种预处理方法对 C(12)SH-SAMs-Au 的表面覆盖率Γ(m)分别为:王水预处理(8.0×10(-10)mol/cm(-2))还原退火预处理(7.8×10(-10)mol/cm(-2))>UV/O(3)预处理(5.0×10(-10)mol/cm(-2))过硫酸氢钾预处理(4.1×10(-10)mol/cm(-2))~简单抛光预处理(4.0×10(-10)mol/cm(-2))。这表明王水和还原退火预处理的 Au 表面可以达到最佳效果,并且得到的Γ(m)值与理论覆盖值(Γ(m)≈8.0×10(-10)mol/cm(-2))一致;然而,其他三种预处理方法(UV/O(3)、过硫酸氢钾和简单抛光)的Γ(m)值并不理想,仅获得了理论Γ(m)值的近一半。因此,我们建议使用王水和还原退火预处理作为自组装烷基硫醇单层(C(n)SH-SAMs-Au)的最佳方法,而不建议使用 UV/O(3)、过硫酸氢钾和简单抛光预处理。

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