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[蚀刻釉质与直接复合树脂、间接复合树脂以及蚀刻和硅烷化瓷的粘结强度]

[Bond strength of etched enamel to direct composite resins, to indirect composite resins and to etched and silanized porcelain].

作者信息

Prévost A P, Desautels P

机构信息

Département de Dentisterie de Restauration, Université de Montréal.

出版信息

J Can Dent Assoc. 1990 Jul;56(7):631-5.

PMID:2204471
Abstract

The adhesion to enamel of composite resin inlays are not documented as much as porcelain inlays and direct composite resins. This study evaluates the adhesion of a light cured composite resin (P-50) used in an indirect technique and secondarily polymerized by heat. No significant differences were found between adhesion of P-50 used with an indirect technique and adhesion of porcelain (Mirage). P-50 used with the direct technique yield adhesion values significantly lower than the indirect techniques.

摘要

复合树脂嵌体与牙釉质的黏附情况,相比瓷嵌体和直接复合树脂而言,相关文献记载较少。本研究评估了一种用于间接技术并通过加热二次聚合的光固化复合树脂(P - 50)的黏附力。结果发现,使用间接技术的P - 50的黏附力与瓷(Mirage)的黏附力之间没有显著差异。采用直接技术的P - 50产生的黏附值明显低于间接技术。

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