[Bond strength of etched enamel to direct composite resins, to indirect composite resins and to etched and silanized porcelain].

The adhesion to enamel of composite resin inlays are not documented as much as porcelain inlays and direct composite resins. This study evaluates the adhesion of a light cured composite resin (P-50) used in an indirect technique and secondarily polymerized by heat. No significant differences were found between adhesion of P-50 used with an indirect technique and adhesion of porcelain (Mirage). P-50 used with the direct technique yield adhesion values significantly lower than the indirect techniques.