Superior performance of multilayered fluoropolymer films in low voltage electrowetting.

The requirement for low operational voltage in electrowetting devices, met using thin dielectrics, is usually connected with serious material failure issues. Dielectric breakdown (visible as electrolysis) is frequently evident slightly beyond the onset of the contact angle saturation. Here, plasma-enhanced chemical vapor deposition (PECVD) is used to deposit thin fluorocarbon films prior to the spin-coating of Teflon® amorphous fluoropolymer. The resulting multilayered hydrophobic top coating improves the electrowetting performance of the stack, by showing high resistance to dielectric breakdown at high applied voltages and for continuous long term application of DC and AC voltage. Leakage current measurements during electrowetting experiments with the proposed composite coating showed that current remains fairly constant at consecutive electrowetting tests in contrast to plain Teflon® coating in which material degradation is evident by a progressive increase in the leakage current after multiple electrowetting tests. Since the proposed composite coating demonstrates increased resistance to material failure and to dielectric breakdown even at thin configurations, its integration in electrowetting devices may impact their reliability, robustness, and lifetime.