TriboLAB, Dipartimento di Ingegneria Meccanica e Gestionale, Politecnico di Bari, Bari, Italy.
Small. 2012 May 7;8(9):1449-54. doi: 10.1002/smll.201102021. Epub 2012 Mar 1.
Very recently, both experimental and theoretical investigations have shown that microstructured surfaces covered with mushroom-shaped micropillars present strongly enhanced adhesive properties if compared to flat surfaces made of the same material. However, different geometries lead to different adhesive performance, and finding the optimal solution has become of utmost importance. This paper presents on which physical basis the optimal mushroom pillar shape should be sought, and it provides a relatively simple methodology to achieve the result. Calculations demonstrate that the adhesive performance of the pillar strongly depends on the geometry of the terminal plate. The best performance is achieved when the ratio s/R(i) between the plate thickness (s) and the pillar internal radius (R(i)) is close to 0.2-0.3, and the ratio R(e)/R(i) is larger than 2, where R(e) is the external radius of the plate.
最近,实验和理论研究都表明,与由相同材料制成的平面相比,覆盖着蘑菇形微柱的微结构表面具有更强的粘附性能。然而,不同的几何形状会导致不同的粘附性能,找到最佳解决方案变得至关重要。本文介绍了应基于何种物理基础来寻找最佳的蘑菇形支柱形状,并提供了一种相对简单的方法来实现这一目标。计算表明,支柱的粘附性能强烈依赖于终端板的几何形状。当板厚(s)与支柱内半径(R(i))的比值 s/R(i)接近 0.2-0.3 时,以及当外部半径 R(e)/R(i)大于 2 时,板的性能最佳,其中 R(e)是板的外部半径。