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采用高声体波谐振器技术提取压电薄膜的机电耦合常数。

Extracting the electromechanical coupling constant of piezoelectric thin film by the high-tone bulk acoustic resonator technique.

机构信息

State Key Laboratory of Precision Measuring Technology and Instruments, Tianjin University, Tianjin, China.

出版信息

IEEE Trans Ultrason Ferroelectr Freq Control. 2012 May;59(5):958-62. doi: 10.1109/TUFFC.2012.2280.

Abstract

In this paper, a new approach is proposed to rapidly and accurately measure the electromechanical coupling constant K(t)(2) of thin film piezoelectric material, which is critically important for real-time quality control of the piezoelectric film growth in mass production. An ideal lossy bulk acoustic resonator (LBAR) model is introduced and the theory behind the method is presented. A high-tone bulk acoustic resonator (HBAR) was fabricated on a silicon wafer. The impedance response of the resonator was measured, from which the K(t)(2) of the piezoelectric material was extracted. To illustrate the potential of the proposed technique to extract material properties, two HBAR devices employing AlN as the piezoelectric material were fabricated using an RF sputter system with known good and bad deposition conditions; the extracted K(t)(2) values of the piezoelectric material are compared.

摘要

本文提出了一种新的方法,可以快速准确地测量薄膜压电材料的机电耦合常数 K(t)(2),这对于大规模生产中压电薄膜生长的实时质量控制至关重要。引入了一个理想的有损体声波谐振器 (LBAR) 模型,并介绍了该方法的原理。在硅片上制造了一个高声体声波谐振器 (HBAR)。测量了谐振器的阻抗响应,从中提取出压电材料的 K(t)(2)。为了说明该技术提取材料特性的潜力,使用具有已知良好和不良沉积条件的射频溅射系统制造了两个采用 AlN 作为压电材料的 HBAR 器件;比较了所提取的压电材料的 K(t)(2)值。

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