Artan N Sertac, Patel Ramesh C, Ning Chengzhi, Chao H Jonathan
Department of Electrical and Computer Engineering at the Polytechnic Institute of New York University, Brooklyn, NY 11201, USA.
Annu Int Conf IEEE Eng Med Biol Soc. 2012;2012:1683-6. doi: 10.1109/EMBC.2012.6346271.
With the exciting developments in the implant technology allowing sophisticated signal processing, stimulation, and drug delivery capabilities, there is new hope for many patients of epilepsy, Parkinson's disease, and stroke to improve their quality of life. Such implants require high power to deliver the promised rich functionality. Yet, delivering high power to implants without damaging the tissue due to heating while keeping the implant footprint small is a challenge. In this paper, we propose a hybrid multi-layer coil as the secondary coil to provide a power and space-efficient solution. The proposed coils can deliver power to an implant for long durations without increasing the skin temperature over 1C.