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卤素光固化机与蓝光发光二极管固化牙科复合材料的固化深度和抗压强度的比较评估:一项体外研究。

A comparative evaluation of curing depth and compressive strength of dental composite cured with halogen light curing unit and blue light emitting diode: an in vitro study.

作者信息

Kumar C N Vijaya, Gururaj M, Paul Joseph

机构信息

Department of Conservative Dentistry and Endodontics, KVG Dental College and Hospital, Sullia, Karnataka, India.

出版信息

J Contemp Dent Pract. 2012 Nov 1;13(6):834-7. doi: 10.5005/jp-journals-10024-1238.

Abstract

PURPOSE

To evaluate the curing depth and compressive strength of dental composite using halogen light curing unit and light emitting diode light curing unit.

MATERIALS AND METHODS

Eighty cylindrical composite specimens were prepared using posterior composite P60(3M). Forty specimens, out of which 20 samples (group A) cured with halogen light and 20 samples (group B) cured using light emitting diode (LED) light were checked for curing depth according to ISO 4049. Remaining 40 samples out of which 20 samples (group I) cured using halogen light and 20 samples (group II) cured using LED light were checked for compressive strength using Instron universal testing machine.

RESULTS

Twenty samples (group A) cured with halogen light showed better curing depth than 20 samples (group B) cured with LED light. Twenty samples (group I) cured with halogen light showed almost similar results as 20 samples (group II) cured with LED light for compressive strength.

CONCLUSION

Halogen light commonly used to cure composite resin have greater depth of cure, when compared to LED light, while both the lights produced compressive strength which is almost similar.

CLINICAL SIGNIFICANCE

Lower depth of cure with the LED unit, compared to the QTH unit, is associated with different light scattering due to differences in spectral emission. LED technology differs from QTH by the spectral emission that favorably matches the absorption spectrum of camphorquinone.

摘要

目的

使用卤素光固化机和发光二极管光固化机评估牙科复合材料的固化深度和抗压强度。

材料与方法

使用后牙复合材料P60(3M)制备80个圆柱形复合试件。根据ISO 4049标准,对40个试件进行固化深度检测,其中20个样本(A组)用卤素光固化,20个样本(B组)用发光二极管(LED)光固化。使用英斯特朗万能试验机对其余40个样本进行抗压强度检测,其中20个样本(I组)用卤素光固化,20个样本(II组)用LED光固化。

结果

用卤素光固化的20个样本(A组)的固化深度比用LED光固化的20个样本(B组)更好。用卤素光固化的20个样本(I组)的抗压强度结果与用LED光固化的20个样本(II组)几乎相似。

结论

与LED光相比,常用于固化复合树脂的卤素光具有更大的固化深度,而两种光产生的抗压强度几乎相似。

临床意义

与石英卤钨灯(QTH)装置相比,LED装置的固化深度较低,这是由于光谱发射的差异导致不同的光散射。LED技术与QTH的不同之处在于其光谱发射与樟脑醌的吸收光谱良好匹配。

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