Banerjee Sujoy, Banerjee Rajlakshmi
Department of Prosthodontics, VSPM Dental College and Research Centre, Nagpur, India.
Indian J Dent Res. 2011 Sep-Oct;22(5):731-2. doi: 10.4103/0970-9290.93469.
With the introduction of photosensitive (light-activated) restorative materials in orthodontics, various methods have been suggested to enhance the polymerization of the materials used, including use of more powerful light curing devices. Bond strength is an important property and determines the amount of force delivered and the treatment duration. Many light-cured bonding materials have become popular but it is the need of the hour to determine the bonding agent that is the most efficient and has the desired bond strength.
To evaluate and compare the shear bond strengths of five different orthodontic light cure bonding materials cured with traditional halogen light and low-intensity light-emitting diode (LED) light curing unit.
100 human maxillary premolar teeth, extracted for orthodontic purpose, were used to prepare the samples. 100 maxillary stainless steel bicuspid brackets of 0.018 slot of Roth prescription, manufactured by D-tech Company, were bonded to the prepared tooth surfaces of the mounted samples using five different orthodontic bracket bonding light-cured materials, namely, Enlight, Fuji Ortho LC (resin-modified glass ionomer cement), Orthobond LC, Relybond, and Transbond XT. The bond strength was tested on an Instron Universal testing machine (model no. 5582).
In Group 1 (halogen group), Enlight showed the highest shear bond strength (16.4 MPa) and Fuji Ortho LC showed the least bond strength (6.59 MPa) (P value 0.000). In Group 2 (LED group), Transbond showed the highest mean shear bond strength (14.6 MPa) and Orthobond LC showed the least mean shear bond strength (6.27 MPa) (P value 0.000). There was no statistically significant difference in the shear bond strength values of all samples cured using either halogen (mean 11.49 MPa) or LED (mean 11.20 MPa), as the P value was 0.713.
Polymerization with both halogen and LED resulted in shear bond strength values which were above the clinically acceptable range given by Reynolds. The LED light curing units produced comparable shear bond strength to that of halogen curing units.
随着正畸领域中光敏（光激活）修复材料的引入，人们提出了各种方法来增强所用材料的聚合，包括使用功率更大的光固化装置。粘结强度是一项重要性能，它决定了传递的力的大小和治疗持续时间。许多光固化粘结材料已广受欢迎，但当下需要确定最有效且具有所需粘结强度的粘结剂。
评估并比较五种不同的正畸光固化粘结材料在传统卤素光和低强度发光二极管（LED）光固化装置下固化后的剪切粘结强度。
选取因正畸目的拔除的100颗人类上颌前磨牙用于制备样本。使用五种不同的正畸托槽粘结光固化材料，即Enlight、Fuji Ortho LC（树脂改性玻璃离子水门汀）、Orthobond LC、Relybond和Transbond XT，将由D-tech公司生产的100个Roth处方的0.018槽上颌不锈钢双尖牙托槽粘结到已制备好的样本牙齿表面。在Instron万能试验机（型号5582）上测试粘结强度。
在第1组（卤素组）中，Enlight显示出最高的剪切粘结强度（16.4兆帕），Fuji Ortho LC显示出最低的粘结强度（6.59兆帕）（P值0.000）。在第2组（LED组）中，Transbond显示出最高的平均剪切粘结强度（14.6兆帕），Orthobond LC显示出最低的平均剪切粘结强度（6.27兆帕）（P值0.000）。使用卤素（平均11.49兆帕）或LED（平均11.20兆帕）固化的所有样本的剪切粘结强度值在统计学上无显著差异，因为P值为0.713。
卤素光和LED光聚合均产生了高于雷诺兹给出的临床可接受范围的剪切粘结强度值。LED光固化装置产生的剪切粘结强度与卤素固化装置相当。
