Université Paris-Sud, ICMMO, UMR CNRS 8182, bât. 410, 91405 Orsay Cedex, France.
Microsc Microanal. 2013 Aug;19(4):969-77. doi: 10.1017/S1431927613000299. Epub 2013 Apr 10.
The microstructural evolution of a cold drawn copper wire (reduction area of 38%) during primary recrystallization and grain growth was observed in situ by electron backscatter diffraction. Two thermal treatments were performed, and successive scans were acquired on samples undergoing heating from ambient temperature to a steady state of 200°C or 215°C. During a third in situ annealing, the temperature was continuously increased up to 600°C. Nuclei were observed to grow at the expense of the deformed microstructure. This growth was enhanced by the high stored energy difference between the nuclei and their neighbors (driving energy in recrystallization) and by the presence of high-angle grain boundaries of high mobility. In the early stages of growth, the nuclei twin and the newly created orientations continue to grow to the detriment of the strained copper. At high temperatures, the disappearance of some twins was evidenced by the migration of the incoherent twin boundaries. Thermal grooving of grain boundaries is observed at these high temperatures and affects the high mobile boundaries but tends to preserve the twin boundaries of lower energy. Thus, grooving may contribute to the twin vanishing.
通过电子背散射衍射，对冷拉铜丝（减面率为 38%）在一次再结晶和晶粒生长过程中的微观结构演变进行了原位观察。进行了两种热处理，在将样品从环境温度加热到 200°C 或 215°C 的稳定状态的过程中，对样品进行了连续扫描。在第三次原位退火过程中，温度连续升高至 600°C。观察到晶核在变形组织的消耗下生长。这种生长受到晶核与其相邻物之间高存储能量差（再结晶驱动力）的增强，以及高迁移率的高角度晶界的存在的增强。在生长的早期阶段，晶核孪晶，新创建的取向继续生长，损害应变铜。在高温下，通过不连续孪晶边界的迁移，证明了一些孪晶的消失。在这些高温下观察到晶界热槽，这会影响高迁移率的边界，但倾向于保留低能量的孪晶边界。因此，槽可能有助于孪晶消失。
