Li Lili, Zhang Shujun, Xu Zhuo, Wen Fei, Geng Xuecang, Lee Hyeong Jae, Shrout Thomas R
Electronic Materials Research Laboratory, Key Laboratory of the Ministry of Education & International Center for Dielectric Research, Xi'an Jiaotong University, Xi'an 710049, P. R. China ; Materials Research Institute, Pennsylvania State University, University Park, Pennsylvania 16802, USA.
J Phys D Appl Phys. 2013 Apr 24;46(16):165306. doi: 10.1088/0022-3727/46/16/165306.
High temperature Pb(Zr,Ti)O /epoxy 1-3 composites were fabricated using the dice and fill method. The epoxy filler was modified with glass spheres in order to improve the thermal reliability of the composites at elevated temperatures. Temperature dependent dielectric and electromechanical properties of the composites were measured after aging at 250°C with different dwelling times. Obvious cracks were observed and the electrodes were damaged in the composite with unmodified epoxy after 200 hours, leading to the failure of the composite. In contrast, composites with >12 vol% glass sphere loaded epoxies were found to exhibit minimal electrical property variation after aging for 500 hours, with dielectric permittivity, piezoelectric coefficient and electromechanical coupling being on the order of 940, 310pC/N and 57%, respectively. This is due to the improved thermal expansion behavior of the modified filler.
采用切块填充法制备了高温Pb(Zr,Ti)O/环氧树脂1-3复合材料。为提高复合材料在高温下的热可靠性,用玻璃微珠对环氧填料进行了改性。在250°C下以不同的保温时间老化后,测量了复合材料随温度变化的介电和机电性能。200小时后,未改性环氧树脂复合材料中观察到明显的裂纹,电极受损,导致复合材料失效。相比之下,发现含>12体积%玻璃微珠的环氧树脂复合材料在老化500小时后电性能变化最小,介电常数、压电系数和机电耦合系数分别约为940、310pC/N和57%。这是由于改性填料的热膨胀行为得到了改善。