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微剪切结合强度和有限元分析,用于修复各种预处理方法后的金属烤瓷修复体的树脂复合材料黏附。

Microshear bond strength and finite element analysis of resin composite adhesion to press-on-metal ceramic for repair actions after various conditioning methods.

出版信息

J Adhes Dent. 2014 Feb;16(1):63-70. doi: 10.3290/j.jad.a30164.

Abstract

PURPOSE

This study evaluated the repair bond strength of differently surface-conditioned press-on-metal ceramic to repair composites and determined the location of the accumulated stresses by finite element analysis.

MATERIALS AND METHODS

Press-on-metal ceramic disks (IPS InLine PoM, Ivoclar Vivadent) (N = 45, diameter: 3 mm, height: 2 mm) were randomly divided into 3 groups (n = 15 per group) and conditioned with one of the following methods: 9.5% hydrofluoric acid (HF) (Porcelain etch), tribochemical silica coating (TS) (CoJet), and an unconditioned group acted as the control (C). Each group was divided into three subgroups depending on the repair composite resins: a) Arabesk Top (V, a microhybrid; VOCO), b) Filtek Z250 (F, a hybrid;3M ESPE); c) Tetric EvoCeram (T, a nanohybrid; Ivoclar Vivadent) (n = 5 per subgroup). Repair composites disks (diameter: 1 mm, height: 1 mm) were photopolymerized on each ceramic block. Microshear bond strength (MSB) tests were performed (1 mm/min) and the obtained data were statistically analyzed using 2-way ANOVA and Tukey's post-hoc test (α = 0.05). Failure types were analyzed under SEM. Vickers indentation hardness, Young's modulus, and finite element analysis (FEA) were performed complementary to MSB tests to determine stress accumulation areas.

RESULTS

MSB results were significantly affected by the surface conditioning methods (p = 0.0001), whereas the repair composite types did not show a significant effect (p = 0.108). The interaction terms between the repair composite and surface conditioning method were also statistically significant (p = 0.0001). The lowest MSB values (MPa ± SD) were obtained in the control group (V = 4 ± 0.8; F = 3.9 ± 0.7; T = 4.1 ± 0.7) (p < 0.05). While the group treated with T composite resulted in significantly lower MSB values for the HF group (T= 4.1 ± 0.8) compared to those of other composites (V = 8.1 ± 2.6; F = 7.6 ± 2.2) (p < 0.05), there were no significant differences when TS was used as a conditioning method (V = 5 ± 1.7; F = 4.7 ± 1; T = 6.2 ± 0.8) (p > 0.05). The control group presented exclusively adhesive failures. Cohesive failures in composite followed by mixed failure types were more common in HF and TS conditioned groups. Elasticity modulus of the composites were 22.9, 12.09, and 10.41 GPa for F, T, and V, respectively. Vickers hardness of the composites were 223, 232, and 375 HV for V, T, and F, respectively. Von Mises stresses in the FEA analysis for the V and T composites spread over a large area due to the low elastic modulus of the composite, whereas the F composite material accumulated more stresses at the bonded interface.

CONCLUSION

Press-on-metal ceramic could best be repaired using tribochemical silica coating followed by silanization, regardless of the repair composite type in combination with their corresponding adhesive resins, providing that no cohesive ceramic failure was observed.

摘要

目的

本研究评估了不同表面处理的烤瓷熔附金属对修复复合材料的修复粘结强度,并通过有限元分析确定了累积应力的位置。

材料和方法

将烤瓷熔附金属圆盘(IPS InLine PoM,Ivoclar Vivadent)(N = 45,直径:3mm,高度:2mm)随机分为 3 组(每组 n = 15),并采用以下方法之一进行处理:9.5%氢氟酸(Porcelain etch)(瓷化剂)、三氧化二硅涂层(CoJet)(硅烷化)和未经处理的对照组(C)。每组根据修复复合材料进一步分为三个亚组:a)Arabesk Top(V,微混合;VOCO),b)Filtek Z250(F,混合;3M ESPE),c)Tetric EvoCeram(T,纳米混合;Ivoclar Vivadent)(每组 n = 5)。将每个陶瓷块上的修复复合材料圆盘(直径:1mm,高度:1mm)进行光聚合。以 1mm/min 的速度进行微剪切粘结强度(MSB)测试,并使用双因素方差分析和 Tukey 事后检验(α = 0.05)对获得的数据进行统计学分析。在 SEM 下分析失效类型。为了确定应力积累区域,还进行了维氏硬度、杨氏模量和有限元分析(FEA)的补充测试。

结果

MSB 结果显著受表面处理方法的影响(p = 0.0001),而修复复合材料类型无显著影响(p = 0.108)。修复复合材料和表面处理方法之间的交互项也具有统计学意义(p = 0.0001)。在对照组(V = 4 ± 0.8;F = 3.9 ± 0.7;T = 4.1 ± 0.7)(p < 0.05)中获得了最低的 MSB 值(MPa ± SD)。在用 T 复合材料处理的组中,与其他复合材料相比,HF 组的 MSB 值(T = 4.1 ± 0.8)显著降低(V = 8.1 ± 2.6;F = 7.6 ± 2.2)(p < 0.05),而当使用 TS 作为处理方法时,没有显著差异(V = 5 ± 1.7;F = 4.7 ± 1;T = 6.2 ± 0.8)(p > 0.05)。对照组仅表现为粘着性失效。HF 和 TS 处理组中,复合材料的内聚性失效后接着是混合性失效类型更为常见。F、T 和 V 复合材料的弹性模量分别为 22.9、12.09 和 10.41GPa。V 复合材料的维氏硬度分别为 223、232 和 375HV,T 和 F 复合材料分别为 232 和 375HV。在 FEA 分析中,由于复合材料的弹性模量较低,V 和 T 复合材料的 Von Mises 应力分布在较大区域,而 F 复合材料材料在粘结界面处积累了更多的应力。

结论

无论修复复合材料类型如何,无论修复复合材料类型如何,烤瓷熔附金属都可以通过三氧化二硅涂层结合硅烷化处理进行最佳修复,前提是观察到没有陶瓷的内聚性失效。

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