Prabriputaloong Satit, Krajangta Nantawan, Klaisiri Awiruth
Division of Restorative Dentistry, Faculty of Dentistry, Thammasat University, Pathum Thani, Thailand.
Eur J Dent. 2025 Feb;19(1):165-172. doi: 10.1055/s-0044-1785531. Epub 2024 May 14.
This study investigates the effect of different chemical surface treatment protocols with different functional monomers of universal adhesives on the shear bond strength between resin-matrix ceramic and resin composite.
Eighty resin-matrix ceramics (Shofu block HC) were built and designed into eight groups of ten specimens and surface treated with HC primer (HC) and/or three universal adhesives (single bond universal [SBU], Scotchbond universal plus [SBP], and Tetric N-bond universal [TNU]) assigning follows; group 1, nonsurface treated; group 2, HC; group 3, SBU; group 4, HC + SBU; group 5, SBP; group 6, HC + SBP; group 7, TNU; group 8, HC + TNU. A template was put on the specimen center, and then pushed packable resin composite. Mechanical testing machinery was used to examine the samples' shear bond strength (SBS) values. To examine failure patterns, the debonded specimen surfaces were examined by a stereomicroscope.
The one-way analysis of variance method was used to evaluate the data, and the Tukey's test was used to determine the significant level ( < 0.05).
The highest SBS was obtained in group 6 (39.25 ± 1.65 MPa). Group 1 (4.15 ± 0.54 MPa) had the lowest SBS. Group 6 exhibited the highest percentage of cohesive failure patterns (70%). High SBS values were frequently correlated with the surface treatment groups and the cohesive failure patterns.
The application of HC primer prior to the universal adhesive is an alternative protocol for enhancing the repair bond strength between resin-matrix ceramic and resin composite interfaces. Moreover, the application of HC primer prior to the SBP is the best strategy for resin-matrix ceramic and resin composite repairs.
本研究调查通用粘结剂中不同功能单体的不同化学表面处理方案对树脂基陶瓷与树脂复合材料之间剪切粘结强度的影响。
制作80个树脂基陶瓷（松风块状HC），设计为8组，每组10个样本，并用HC底胶（HC）和/或三种通用粘结剂（单键通用型[SBU]、Scotchbond通用增强型[SBP]和Tetric N-bond通用型[TNU]）进行表面处理，分组如下：第1组，未进行表面处理；第2组，HC；第3组，SBU；第4组，HC + SBU；第5组，SBP；第6组，HC + SBP；第7组，TNU；第8组，HC + TNU。在样本中心放置一个模板，然后填入可压实树脂复合材料。使用机械测试仪器检测样本的剪切粘结强度（SBS）值。为检查失效模式，通过体视显微镜检查脱粘样本的表面。
采用单因素方差分析方法评估数据，使用Tukey检验确定显著水平（<0.05）。
第6组获得最高的SBS（39.25±1.65MPa）。第1组（4.15±0.54MPa）的SBS最低。第6组表现出最高比例的内聚破坏模式（70%）。高SBS值通常与表面处理组和内聚破坏模式相关。
在通用粘结剂之前应用HC底胶是提高树脂基陶瓷与树脂复合材料界面修复粘结强度的一种替代方案。此外，在SBP之前应用HC底胶是树脂基陶瓷和树脂复合材料修复的最佳策略。
