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脉冲比对通过电化学辅助沉积在钛上共沉积铜物种与磷酸钙涂层的影响。

Influence of pulse ratio on codeposition of copper species with calcium phosphate coatings on titanium by means of electrochemically assisted deposition.

作者信息

Wolf-Brandstetter Cornelia, Oswald Steffen, Bierbaum Susanne, Wiesmann Hans-Peter, Scharnweber Dieter

机构信息

Institute of Materials Science and Max Bergmann Center of Biomaterials, TU Dresden, Dresden, 01062, Germany.

出版信息

J Biomed Mater Res B Appl Biomater. 2014 Jan;102(1):160-72. doi: 10.1002/jbm.b.32992. Epub 2013 Aug 1.

Abstract

Aim of this study was to combine the well-known biocompatibility and ostoeconductivity of thin calcium phosphate coatings on titanium with proangiogenic signals from codeposited copper species. Copper species could be integrated in mineral layers based on hydroxyapatite by means of electrochemically assisted deposition from electrolytes containing calcium, phosphate, and copper ions. Different combinations of duration and intensity of galvanostatic pulses result in different amounts of deposited calcium phosphate and of copper species even for the same applied total charge. Absolute amounts of copper varied between 2.1 and 6.9 μg/cm², and the copper was distributed homogeneously as shown by EDX mapping. The presence of copper did not change the crystalline phase of deposited calcium phosphate (hydroxyapatite) but provoked a significant decrease in deposited amounts by factor 3 to 4. The copper was deposited mainly as Cu(I) species with a minor fraction of basic copper phosphates. Reduction of copper occurred not only at the surface of titanium but also within the hydroxyapatite coating due to the reaction with hydrogen produced by the electrolysis of water during the cathodic polarization of the substrate.

摘要

本研究的目的是将钛上薄磷酸钙涂层众所周知的生物相容性和骨传导性与共沉积铜物种产生的促血管生成信号相结合。通过从含有钙、磷酸盐和铜离子的电解质中进行电化学辅助沉积,铜物种可以整合到基于羟基磷灰石的矿物层中。即使对于相同的施加总电荷,恒电流脉冲的持续时间和强度的不同组合也会导致不同量的磷酸钙和铜物种沉积。铜的绝对量在2.1至6.9μg/cm²之间变化,并且如能量色散X射线光谱映射所示,铜均匀分布。铜的存在并未改变沉积的磷酸钙(羟基磷灰石)的晶相,但使沉积量显著减少了3至4倍。铜主要以Cu(I)物种形式沉积,少量为碱式磷酸铜。由于在基材阴极极化过程中水电解产生的氢气与之反应,铜的还原不仅发生在钛表面,也发生在羟基磷灰石涂层内部。

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