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基于铜的电气背板与基于光纤的背板之间的性能比较。

Performance comparison between electrical copper-based and optical fiber-based backplanes.

作者信息

Boletti Anna, Giacomuzzi Daniela, Parladori Giorgio, Boffi Pierpaolo, Ferrario Maddalena, Martinelli Mario

机构信息

Politecnico di Milano, Dept. Electronics Information and Bioengineering, via G. Ponzio, 34/5, 20133 Milano, Italy.

出版信息

Opt Express. 2013 Aug 12;21(16):19202-8. doi: 10.1364/OE.21.019202.

DOI:10.1364/OE.21.019202
PMID:23938837
Abstract

A performance comparison between the electrical Cu-based backplane and a full-optical fiber-based backplane is presented in terms of capacity and power consumption. By means of systematic simulations we find the electrical configuration, which allows to optimize the Cu-based backplane by exploiting the best technologies available today. On the other hand, a fiber-based optical backplane is proposed by exploiting the most performing VCSEL sources. Limitations of the electrical and optical approaches are discussed, considering their capabilities to support up to about 25-Gb/s transmission and the possibility to evolve towards higher bit-rates.

摘要

从容量和功耗方面对基于铜的电气背板和基于全光纤的背板进行了性能比较。通过系统仿真,我们找到了一种电气配置,它可以利用当今可用的最佳技术来优化基于铜的背板。另一方面,通过利用性能最佳的垂直腔面发射激光器(VCSEL)光源,提出了一种基于光纤的光背板。讨论了电气和光学方法的局限性,同时考虑了它们支持高达约25Gb/s传输的能力以及向更高比特率发展的可能性。

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