Institute for Measurement Systems and Sensor Technology, Technische Universität München, Theresienstr. 90/N5, Munich 80333, Germany.
Sensors (Basel). 2013 Nov 18;13(11):15747-57. doi: 10.3390/s131115747.
During the manufacturing of printed electronic circuits, different layers of coatings are applied successively on a substrate. The correct thickness of such layers is essential for guaranteeing the electronic behavior of the final product and must therefore be controlled thoroughly. This paper presents a model for measuring two-layer systems through thin film reflectometry (TFR). The model considers irregular interfaces and distortions introduced by the setup and the vertical vibration movements caused by the production process. The results show that the introduction of these latter variables is indispensable to obtain correct thickness values. The proposed approach is applied to a typical configuration of polymer electronics on transparent and non-transparent substrates. We compare our results to those obtained using a profilometer. The high degree of agreement between both measurements validates the model and suggests that the proposed measurement method can be used in industrial applications requiring fast and non-contact inspection of two-layer systems. Moreover, this approach can be used for other kinds of materials with known optical parameters.
在印刷电子电路的制造过程中，不同的涂层会被逐层施加在基底上。这些层的正确厚度对于保证最终产品的电子性能至关重要，因此必须进行严格控制。本文提出了一种通过薄膜反射计（TFR）测量双层系统的模型。该模型考虑了不规则的界面和由设置引起的失真以及由生产过程引起的垂直振动运动。结果表明，引入这些变量对于获得正确的厚度值是必不可少的。所提出的方法应用于透明和不透明基底上的聚合物电子典型配置。我们将我们的结果与使用轮廓仪获得的结果进行了比较。两种测量之间的高度一致性验证了该模型，并表明所提出的测量方法可用于需要快速非接触式检查双层系统的工业应用。此外，该方法可用于具有已知光学参数的其他类型的材料。
