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通过形态改善,胶体溶液处理的 CuInSe2 太阳能电池的效率显著提高至 9%。

Colloidal solution-processed CuInSe2 solar cells with significantly improved efficiency up to 9% by morphological improvement.

机构信息

Photo-electronic Hybrids Research Center, Korea Institute of Science and Technology (KIST) , Seoul 136-791, Korea.

出版信息

ACS Appl Mater Interfaces. 2014 Jan 8;6(1):259-67. doi: 10.1021/am4040976. Epub 2013 Dec 19.

Abstract

We demonstrate here that an improvement in the green density leads to a great enhancement in the photovoltaic performance of CuInSe2 (CISe) solar cells fabricated with Cu-In nanoparticle precursor films via colloidal solution deposition. Cold-isostatic pressing (CIP) increases the precursor film density by ca. 20%, which results in an appreciable improvement in the microstructural features of the sintered CISe film in terms of a lower porosity, a more uniform surface morphology, and a thinner MoSe2 layer. The low-band-gap (1.0 eV) CISe solar cells with the CIP-treated films exhibit greatly enhanced open-circuit voltage (V(OC), typically from 0.265 to 0.413 V) and fill factor (FF, typically from 0.34 to 0.55), compared to the control devices. As a consequence, an almost 3-fold increase in the average efficiency, from 3.0 to 8.2% (with the highest value of 9.02%), is realized. Diode analysis reveals that the enhanced V(OC) and FF are essentially attributed to the reduced reverse saturation current density and diode ideality factor. This is associated with suppressed recombination, likely due to the reduction in recombination sites at grain/air surfaces, intergranular interfaces, and defective CISe/CdS junctions. From the temperature dependences of V(OC), it is revealed that CIP-treated devices suffer less from interface recombination.

摘要

我们在此证明,通过胶体溶液沉积用铜-铟纳米颗粒前体膜制造的铜铟硒(CISe)太阳能电池,绿色密度的提高会极大地增强其光伏性能。冷等静压(CIP)将前体膜密度提高约 20%,这导致烧结 CISe 膜的微结构特征得到显著改善,表现为更低的孔隙率、更均匀的表面形态和更薄的 MoSe2 层。经过 CIP 处理的薄膜制成的低带隙(1.0 eV)CISe 太阳能电池的开路电压(V(OC),通常从 0.265 增加到 0.413 V)和填充因子(FF,通常从 0.34 增加到 0.55)有了很大的提高,与对照器件相比。因此,平均效率从 3.0%提高到 8.2%(最高值为 9.02%),几乎提高了 3 倍。二极管分析表明,增强的 V(OC)和 FF 主要归因于反向饱和电流密度和二极管理想因子的降低。这与复合减少有关,可能是由于晶粒/空气表面、晶界界面和有缺陷的 CISe/CdS 结处的复合位点减少。从 V(OC)的温度依赖性可以看出,CIP 处理的器件受界面复合的影响较小。

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