Blaiszik B J, Jones A R, Sottos N R, White S R
Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign , Urbana, IL , USA .
J Microencapsul. 2014;31(4):350-4. doi: 10.3109/02652048.2013.858790. Epub 2014 Feb 4.
Microcapsules containing a liquid metal alloy core of gallium-indium (Ga-In) are prepared via in situ urea-formaldehyde (UF) microencapsulation. The capsule size, shape, thermal properties, and shell wall thickness are investigated. We prepare ellipsoidal capsules with major and minor diameter aspect ratios ranging from 1.64 to 1.08 and with major diameters ranging from 245 µm to 3 µm. We observe that as the capsule major diameter decreases, the aspect ratio approaches 1. The thermal properties of the prepared microcapsules are investigated by thermogravimetric (TGA) and differential scanning calorimetry (DSC). Microcapsules are shown to survive incorporation into an epoxy matrix and to trigger via mechanical damage to the cured matrix. Microcapsules containing liquid metal cores may have diverse applications ranging from self-healing to contrast enhancement or the demonstration of mechano-adaptive circuitry.
通过原位脲醛（UF）微胶囊化制备了含有镓铟（Ga-In）液态金属合金核的微胶囊。研究了胶囊的尺寸、形状、热性能和壳壁厚度。我们制备了长径比在1.64至1.08之间且长径在245 µm至3 µm之间的椭圆形胶囊。我们观察到，随着胶囊长径减小，长径比趋近于1。通过热重分析（TGA）和差示扫描量热法（DSC）研究了所制备微胶囊的热性能。结果表明，微胶囊在掺入环氧基质后仍能存活，并可通过对固化基质的机械损伤来触发。含有液态金属核的微胶囊可能有多种应用，从自愈到对比度增强或机械自适应电路的展示。
