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[烤瓷过程中非贵金属-陶瓷界面的反应(2)。一种含较高铬和硅的商用合金]

[Reactions at the nonprecious metal-ceramic interface during porcelain firing (2). A commercial alloy containing higher Cr and Si].

作者信息

Watanabe K, Okawa S, Miyakawa O, Nakano S, Shiokawa N, Kobayashi M

出版信息

Shika Zairyo Kikai. 1989 Sep;8(5):667-77.

PMID:2490211
Abstract

To clarify the interface reaction between porcelain and a commercial Ni-Cr dental alloy (containing higher Cr and Si) during porcelain firing, electron probe microanalyzer (EPMA), X-ray diffraction and X-ray fluorescence analysis have been used to characterize the interface which has emerged by means of selective dissolution of the alloy caused by a bromine-methanol solution. At the early stage of firing, tin oxides (SnO2), contained in the porcelain powder, were reduced to Sn metal and the resultant reduction layer was about 10 microns in thickness from the interface. Although in the beginning of firing some Cr oxides were formed at the interface, with increasing retention time (within a few minutes) at 960 degrees C, extremely low oxygen partial pressure caused reduction of even such products.

摘要

为了阐明烤瓷过程中瓷与一种商用镍铬牙科合金(含较高的铬和硅)之间的界面反应,采用电子探针微分析仪(EPMA)、X射线衍射和X射线荧光分析对通过溴 - 甲醇溶液对合金的选择性溶解而出现的界面进行表征。在烧制初期,瓷粉中所含的氧化锡(SnO₂)被还原为锡金属,从界面起形成的还原层厚度约为10微米。虽然在烧制开始时界面处形成了一些氧化铬,但随着在960℃下保持时间的增加(几分钟内),极低的氧分压甚至使这些产物也发生了还原。

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