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通过采用调制紫外光固化树脂的卷对卷工艺连续且可扩展地制造仿生干粘合剂。

Continuous and scalable fabrication of bioinspired dry adhesives via a roll-to-roll process with modulated ultraviolet-curable resin.

作者信息

Yi Hoon, Hwang Insol, Lee Jeong Hyeon, Lee Dael, Lim Haneol, Tahk Dongha, Sung Minho, Bae Won-Gyu, Choi Se-Jin, Kwak Moon Kyu, Jeong Hoon Eui

机构信息

Department of Mechanical Engineering, Ulsan National Institute of Science and Technology , Ulsan 689-798, Republic of Korea.

出版信息

ACS Appl Mater Interfaces. 2014 Aug 27;6(16):14590-9. doi: 10.1021/am503901f. Epub 2014 Aug 13.

Abstract

A simple yet scalable strategy for fabricating dry adhesives with mushroom-shaped micropillars is achieved by a combination of the roll-to-roll process and modulated UV-curable elastic poly(urethane acrylate) (e-PUA) resin. The e-PUA combines the major benefits of commercial PUA and poly(dimethylsiloxane) (PDMS). It not only can be cured within a few seconds like commercial PUA but also possesses good mechanical properties comparable to those of PDMS. A roll-type fabrication system equipped with a rollable mold and a UV exposure unit is also developed for the continuous process. By integrating the roll-to-roll process with the e-PUA, dry adhesives with spatulate tips in the form of a thin flexible film can be generated in a highly continuous and scalable manner. The fabricated dry adhesives with mushroom-shaped microstructures exhibit a strong pull-off strength of up to ∼38.7 N cm(-2) on the glass surface as well as high durability without any noticeable degradation. Furthermore, an automated substrate transportation system equipped with the dry adhesives can transport a 300 mm Si wafer over 10,000 repeating cycles with high accuracy.

摘要

通过卷对卷工艺与调制的紫外光固化弹性聚(聚氨酯丙烯酸酯)(e-PUA)树脂相结合,实现了一种制造具有蘑菇形微柱的干粘合剂的简单且可扩展的策略。e-PUA兼具商用PUA和聚二甲基硅氧烷(PDMS)的主要优点。它不仅能像商用PUA一样在几秒钟内固化,而且具有与PDMS相当的良好机械性能。还开发了一种配备可滚动模具和紫外线曝光单元的卷式制造系统用于连续工艺。通过将卷对卷工艺与e-PUA相结合,可以以高度连续和可扩展的方式生成呈薄柔性薄膜形式且带有铲形尖端的干粘合剂。所制造的具有蘑菇形微结构的干粘合剂在玻璃表面表现出高达约38.7 N cm(-2) 的强大剥离强度以及高耐久性,且无任何明显降解。此外,配备有干粘合剂的自动基板传输系统能够高精度地传输300 mm硅片超过10000个重复周期。

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