石英谐振器采用聚合物密封或金属键合与 TSV 转接板组装。

Quartz resonator assembling with TSV interposer using polymer sealing or metal bonding.

机构信息

Department of Electronics Engineering, National Chiao Tung University, Hsinchu 300, Taiwan.

TXC Corporation, Taoyuan 324, Taiwan.

出版信息

Nanoscale Res Lett. 2014 Oct 1;9(1):541. doi: 10.1186/1556-276X-9-541. eCollection 2014.

DOI:10.1186/1556-276X-9-541

PMID:25324705

原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC4197941/

Abstract

This paper presents one wafer level packaging approach of quartz resonator based on through-silicon via (TSV) interposer with metal or polymer bonding sealing of frequency components. The proposed silicon-based package of quartz resonator adopts several three-dimensional (3D) core technologies, such as Cu TSVs, sealing bonding, and wafer thinning. It is different from conventional quartz resonator using ceramic-based package. With evaluation of mechanical structure design and package performances, this quartz resonator with advanced silicon-based package shows great manufacturability and excellent performance to replace traditional metal lid with ceramic-based interposer fabrication approach.

摘要

本文提出了一种基于硅通孔（TSV）中介层的石英谐振器晶圆级封装方法，该方法采用金属或聚合物键合密封频率元件。所提出的基于硅的石英谐振器封装采用了几种三维（3D）核心技术，如 Cu TSV、密封键合和晶圆减薄。它与使用陶瓷基封装的传统石英谐振器不同。通过对机械结构设计和封装性能的评估，这种采用先进硅基封装的石英谐振器具有出色的制造能力和优异的性能，可以替代传统采用金属盖和陶瓷中介层制造方法的石英谐振器。