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单模-多模-单模光纤结构的温度交叉敏感性特性

Temperature cross-sensitivity characteristics of singlemode-multimode-singlemode fiber structure.

作者信息

Zhang Rongxiang, Liu Tiegen, Han Qun, Chen Yaofei, Li Lin, Yao X Steve

机构信息

College of Precision Instrument and Opto-Electronics Engineering, Tianjin University, Tianjin 300072, China and Key Laboratory of Opto-Electronics Information Technical, Tianjin University, Ministry of Education, Tianjin 300072, China.

出版信息

Rev Sci Instrum. 2015 Jan;86(1):013108. doi: 10.1063/1.4905723.

Abstract

The temperature cross-sensitivity characteristics of a singlemode-multimode-singlemode (SMS) fiber structure packaged by a shell are studied both theoretically and experimentally. By theoretical investigation, we found that the temperature sensitivity of a SMS structure is mainly determined by the thermo-optic effect (TOE) of the cladding of the multimode fiber (MMF). Meanwhile, the TOE of the MMF core, thermal expansion effects (TEEs) of the MMF core, and the packaging material also influence the ultimate sensitivity, and the magnitude of their effects depends on the refractive index of the MMF cladding. Among them, the TEE of the packaging material, inducing an axial strain, is considered to be the second main factor. A temperature sensor based on a packaged SMS structure is designed and investigated to experimentally verify the theoretical findings. The experimentally measured temperature sensitivity of the sensor is -453.4 pm/°C, which agrees well with the theoretical prediction.

摘要

对一种由外壳封装的单模-多模-单模(SMS)光纤结构的温度交叉敏感性特性进行了理论和实验研究。通过理论研究,我们发现SMS结构的温度敏感性主要由多模光纤(MMF)包层的热光效应(TOE)决定。同时,MMF纤芯的TOE、MMF纤芯的热膨胀效应(TEE)以及封装材料也会影响最终的敏感性,其影响程度取决于MMF包层的折射率。其中,封装材料的TEE会引起轴向应变,被认为是第二个主要因素。设计并研究了一种基于封装SMS结构的温度传感器,以通过实验验证理论结果。该传感器的实验测量温度敏感性为-453.4 pm/°C,与理论预测结果吻合良好。

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