通过“Ag+ 焊接”克服 DNA 可编程纳米粒子组装中的偶联困境。
Overcoming the Coupling Dilemma in DNA-Programmable Nanoparticle Assemblies by "Ag+ Soldering".
机构信息
CAS Key Laboratory of Soft Matter Chemistry, School of Chemistry and Materials Science, University of Science and Technology of China, 96 Jinzhai Road, Hefei, Anhui, 230026, P.R. China.
Engineering and Materials Science Experiment Center, University of Science and Technology of China, 96 Jinzhai Road, Hefei, Anhui, 230026, P.R. China.
出版信息
Small. 2015 May 20;11(19):2247-51. doi: 10.1002/smll.201403108. Epub 2015 Jan 8.
Strong coupling between nanoparticles is critical for facilitating charge and energy transfers. Despite the great success of DNA-programmable nanoparticle assemblies, the very weak interparticle coupling represents a key barrier to various applications. Here, an extremely simple, fast, and highly efficient process combining DNA-programming and molecular/ionic bonding is developed to address this challenge, which exhibits a seamless fusion with DNA nanotechnology.
纳米粒子之间的强耦合对于促进电荷和能量转移至关重要。尽管 DNA 可编程纳米粒子组装取得了巨大成功，但非常弱的粒子间耦合是各种应用的关键障碍。在这里，开发了一种结合 DNA 编程和分子/离子键的极其简单、快速和高效的过程来解决这一挑战，该过程与 DNA 纳米技术实现了无缝融合。
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