Lappalainen R, Yli-Urpo A, Seppä L
Proc Finn Dent Soc. 1989;85(1):25-8.
The aim of this study was to determine the release of Au, Cu, Sn, Zn, and Ag from five commercially available Cd-free gold solders. The electropotential system in modified Fusayma solution was used. The cycle process was repeated between +/- 250 mV for 24 hours. To study the ion release, samples of solution were analysed during the process. Rapid release of Zn from most alloys was found. Cu and Ag ions were also released, but only small amounts of the latter. Au showed very good passivation up to 24 hours. The use of soldered joints should be reduced in order to minimize corrosion.
本研究的目的是测定五种市售无镉金焊料中金、铜、锡、锌和银的释放情况。使用了改良的Fusayma溶液中的电势系统。在+/- 250 mV之间重复循环过程24小时。为了研究离子释放情况，在过程中对溶液样本进行了分析。发现大多数合金中锌的释放速度很快。铜和银离子也有释放，但银离子释放量很少。金在24小时内表现出非常好的钝化性能。应减少焊接接头的使用，以尽量减少腐蚀。
