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在Cu2+存在的情况下,替代补体途径的B因子通过二硫键聚合,并受到C3的主要片段C3b的刺激。

Polymerization of factor B of the alternative complement pathway via disulfide bond(s) in the presence of Cu2+ and stimulation by C3b, the major fragment of C3.

作者信息

Matsushita M, Iwasaki A, Okada H

机构信息

Department of Microbiology, Fukuoka University School of Medicine, Japan.

出版信息

Biochem Biophys Res Commun. 1989 Nov 30;165(1):101-5. doi: 10.1016/0006-291x(89)91039-5.

Abstract

Factor B(B) of the alternative complement pathway has been found to dimerize via disulfide bond(s) in the presence of CuCl2. Poly B has no B activity. The Bb fragment was also dimerized, indicating that one free sulfhydryl group on the Bb portion might be involved in polymerization. The Ba fragment was not dimerized. C3b, the major fragment of C3, has the capacity to stimulate polymerization of B. Incubation of C3b, B and factor D in the presence of Mg2+ and Cu2+ resulted in the formation of poly B and diminished cleavage of B. These results suggest that polymerization of B due to Cu2+ might be partly responsible for the impairment of C3 convertase activity of the alternative pathway.

摘要

已发现补体替代途径的B因子(B)在氯化铜存在的情况下通过二硫键形成二聚体。多聚B没有B活性。Bb片段也形成了二聚体,这表明Bb部分上的一个游离巯基可能参与了聚合反应。Ba片段没有形成二聚体。C3的主要片段C3b具有刺激B聚合的能力。在镁离子和铜离子存在的情况下,将C3b、B和D因子一起孵育会导致多聚B的形成以及B的裂解减少。这些结果表明,铜离子导致的B聚合可能部分导致了替代途径C3转化酶活性的受损。

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