Yoshimine Nariaki, Shimada Yasushi, Tagami Junji, Sadr Alireza
J Adhes Dent. 2015 Aug;17(4):329-36. doi: 10.3290/j.jad.a34554.
To investigate the effects of placement technique and adhesive material on adaptation of composites before and after light curing.
Cylindrical cavities (3 mm diameter, 1.7 mm depth) in extracted human molars were restored in 6 groups (n=5) using 2 adhesives--two-step self-etching Clearfil SE Bond 2 (SE2) and all-in-one Clearfil Tri-S Bond Plus (TSP) (Kuraray Noritake Dental)--and 2 composites--Estelite Sigma Quick (ESQ) and Estelite Flow Quick (FLQ) (Tokuyama Dental)--placed with three different techniques: ESQ bulk placed, FLQ lining followed by ESQ and FLQ bulk placed. Specimens were scanned twice using swept-source optical coherence tomography (SS-OCT) before and after photopolymerization of the composite. Gap formation during polymerization or the difference in floor interface (DFI%) and final unsealed interface (USI%) were measured by image coregistration and subtraction on 6 diametrical planes across each scan.
Two-way ANOVA suggested that both factors (adhesive and filling technique) and their interaction were significant (p<0.001). SE2 showed significantly lower DFI% than did TSP when the composites were placed in bulk, but no difference was found when flowable lining was applied (p<0.05). Within TSP, all filling techniques were significantly different and the lining group showed the lowest values, followed by ESQ-bulk. Overall, SE2 always showed lower UFI% than did TSP, while there was no difference among different techniques within SE2.
SS-OCT is a unique method to observe the pre-existing interfacial defects and gaps developed during polymerization, which were found to depend on both placement technique and applied adhesive.
研究充填技术和粘结材料对复合树脂在光固化前后适应性的影响。
在拔除的人磨牙上制备圆柱形窝洞(直径3mm,深度1.7mm),分为6组(n = 5),使用两种粘结剂——两步自酸蚀Clearfil SE Bond 2(SE2)和单组分Clearfil Tri-S Bond Plus(TSP)(可乐丽诺瑞特牙科公司)——以及两种复合树脂——Estelite Sigma Quick(ESQ)和Estelite Flow Quick(FLQ)(德山牙科公司),采用三种不同的技术进行充填:ESQ整体充填、FLQ垫底后ESQ整体充填以及FLQ整体充填。在复合树脂光固化前后,使用扫频光学相干断层扫描(SS - OCT)对标本进行两次扫描。通过图像配准和减法运算,在每次扫描的6个直径平面上测量聚合过程中的间隙形成或髓底界面差异(DFI%)和最终未封闭界面(USI%)。
双向方差分析表明,两个因素(粘结剂和充填技术)及其相互作用均具有显著性(p < 0.001)。当复合树脂整体充填时,SE2的DFI%显著低于TSP,但应用可流动衬层时未发现差异(p < 0.05)。在TSP组中,所有充填技术均有显著差异,衬层组的值最低,其次是ESQ整体充填组。总体而言,SE2的UFI%始终低于TSP,而在SE2组内不同技术之间没有差异。
SS - OCT是一种观察聚合过程中预先存在的界面缺陷和间隙的独特方法,发现这些缺陷和间隙取决于充填技术和所应用的粘结剂。