Flow and Thermal Performance of a Water-Cooled Periodic Transversal Elliptical Microchannel Heat Sink for Chip Cooling.

Flow and thermal performance of transversal elliptical microchannels were investigated as a passive scheme to enhance the heat transfer performance of laminar fluid flow. The periodic transversal elliptical micro-channel is designed and its pressure drop and heat transfer characteristics in laminar flow are numerically investigated. Based on the comparison with a conventional straight micro- channel having rectangular cross section, it is found that periodic transversal elliptical microchannel not only has great potential to reduce pressure drop but also dramatically enhances heat transfer performance. In addition, when the Reynolds number equals to 192, the pressure drop of the transversal elliptical channel is 36.5% lower than that of the straight channel, while the average Nusselt number is 72.8% higher; this indicates that the overall thermal performance of the periodic transversal elliptical microchannel is superior to the conventional straight microchannel. It is suggested that such transversal elliptical microchannel are attractive candidates for cooling future electronic chips effectively with much lower pressure drop.