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基于硅-硅直接键合的微通道和微针肋片式片上冷却系统的实验研究

An Experimental Study of Microchannel and Micro-Pin-Fin Based On-Chip Cooling Systems with Silicon-to-Silicon Direct Bonding.

作者信息

Qiu Yunlong, Hu Wenjie, Wu Changju, Chen Weifang

机构信息

School of Aeronautics and Astronautics, Zhejiang University, Zheda Road, Hangzhou 310027, China.

出版信息

Sensors (Basel). 2020 Sep 27;20(19):5533. doi: 10.3390/s20195533.

DOI:10.3390/s20195533
PMID:32992553
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC7583888/
Abstract

This paper describes an experimental study of the cooling capabilities of microchannel and micro-pin-fin based on-chip cooling systems. The on-chip cooling systems integrated with a micro heat sink, simulated power IC (integrated circuit) and temperature sensors are fabricated by micromachining and silicon-to-silicon direct bonding. Three micro heat sink structures: a microchannel heat sink (MCHS), an inline micro-pin-fin heat sink (I-MPFHS) and a staggered micro-pin-fin heat sink (S-MPFHS) are tested in the Reynolds number range of 79.2 to 882.3. The results show that S-MPFHS is preferred if the water pump can provide enough pressure drop. However, S-MPFHS has the worst performance when the rated pressure drop of the pump is lower than 1.5 kPa because the endwall effect under a low Reynolds number suppresses the disturbance generated by the staggered micro pin fins but S-MPFHS is still preferred when the rated pressure drop of the pump is in the range of 1.5 to 20 kPa. When the rated pressure drop of the pump is higher than 20 kPa, I-MPFHS will be the best choice because of high heat transfer enhancement and low pressure drop price brought by the unsteady vortex street.

摘要

本文描述了基于微通道和微针翅片的片上冷却系统冷却能力的实验研究。通过微加工和硅-硅直接键合制造了集成微散热器、模拟功率集成电路(IC)和温度传感器的片上冷却系统。测试了三种微散热器结构:微通道散热器(MCHS)、串联微针翅片散热器(I-MPFHS)和交错微针翅片散热器(S-MPFHS),雷诺数范围为79.2至882.3。结果表明,如果水泵能够提供足够的压降,则S-MPFHS是首选。然而,当泵的额定压降低于1.5 kPa时,S-MPFHS的性能最差,因为低雷诺数下的端壁效应抑制了交错微针翅片产生的扰动,但当泵的额定压降在1.5至20 kPa范围内时,S-MPFHS仍然是首选。当泵的额定压降高于20 kPa时,由于不稳定涡街带来的高传热增强和低压降代价,I-MPFHS将是最佳选择。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bceb/7583888/8402fcb3b92e/sensors-20-05533-g008.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bceb/7583888/251089c0281d/sensors-20-05533-g003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bceb/7583888/8402fcb3b92e/sensors-20-05533-g008.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bceb/7583888/251089c0281d/sensors-20-05533-g003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bceb/7583888/8402fcb3b92e/sensors-20-05533-g008.jpg

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本文引用的文献

1
A Comprehensive Study of a Micro-Channel Heat Sink Using Integrated Thin-Film Temperature Sensors.使用集成薄膜温度传感器的微通道散热器综合研究。
Sensors (Basel). 2018 Jan 19;18(1):299. doi: 10.3390/s18010299.
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Three-Dimensional Integrated Circuit (3D IC) Key Technology: Through-Silicon Via (TSV).三维集成电路(3D IC)关键技术:硅通孔(TSV)。
Nanoscale Res Lett. 2017 Dec;12(1):56. doi: 10.1186/s11671-017-1831-4. Epub 2017 Jan 19.