Liu Chunyuan, Kim Jin Seuk, Kwon Younghwan
J Nanosci Nanotechnol. 2016 Feb;16(2):1703-7. doi: 10.1166/jnn.2016.11985.
This paper presents a comparative study on thermal conductivity of PU composites containing open-cell nano-porous silica aerogel and closed-cell hollow silica microsphere, respectively. The thermal conductivity of PU composites is measured at 30 degrees C with transient hot bridge method. The insertion of polymer in pores of silica aerogel creates mixed interfaces, increasing the thermal conductivity of resulting composites. The measured thermal conductivity of PU composites filled with hollow silica microspheres is estimated using theoretical models, and is in good agreement with Felske model. It appears that the thermal conductivity of composites decreases with increasing the volume fraction (phi) when hollow silica microsphere (eta = 0.916) is used.
本文分别对含有开孔纳米多孔二氧化硅气凝胶和闭孔中空二氧化硅微球的聚氨酯(PU)复合材料的热导率进行了比较研究。采用瞬态热桥法在30℃下测量了PU复合材料的热导率。聚合物插入二氧化硅气凝胶的孔隙中形成了混合界面,从而提高了所得复合材料的热导率。使用理论模型估算了填充中空二氧化硅微球的PU复合材料的热导率测量值,该值与费尔斯克模型吻合良好。当使用中空二氧化硅微球(η = 0.916)时,复合材料的热导率似乎随着体积分数(φ)的增加而降低。