Lee Eun Yong, Chae Il Seok, Park Dongkyung, Suh Hongsuk, Kang Sang Wook
J Nanosci Nanotechnol. 2016 Mar;16(3):3009-13. doi: 10.1166/jnn.2016.11117.
Epoxy resin has been required to have a low dielectric constant (D(k)), low dissipation factor (Df), low coefficient of thermal expansion (CTE), low water absorption, high mechanical, and high adhesion properties for various applications. A series of novel phenolic isocyanate-modified bisphenol-based epoxy resins comprising benzoate group were prepared for practical electronic packaging applications. The developed epoxy resins showed highly reduced dielectric constants (D(k)-3.00 at 1 GHz) and low dissipation values (Df-0.014 at 1 GHz) as well as enhanced thermal properties.
对于各种应用而言，环氧树脂需要具有低介电常数（D(k)）、低损耗因子（Df）、低热膨胀系数（CTE）、低吸水性、高机械性能和高粘附性。为了实际的电子封装应用，制备了一系列包含苯甲酸酯基团的新型酚醛异氰酸酯改性双酚基环氧树脂。所开发的环氧树脂显示出显著降低的介电常数（1 GHz时D(k) - 3.00）和低损耗值（1 GHz时Df - 0.014）以及增强的热性能。
