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电化学软模板法首次合成具有均匀孔径的连续介孔铜膜。

First Synthesis of Continuous Mesoporous Copper Films with Uniformly Sized Pores by Electrochemical Soft Templating.

机构信息

International Center for Materials Nanoarchitectonics (MANA), National Institute for Materials Science (NIMS), 1-1 Namiki, Tsukuba, Ibaraki, 305-0044, Japan.

Australian Institute for Innovative Materials (AIIM), University of Wollongong, Squires Way, North Wollongong, NSW, 2500, Australia.

出版信息

Angew Chem Int Ed Engl. 2016 Oct 4;55(41):12746-50. doi: 10.1002/anie.201606031. Epub 2016 Aug 24.

DOI:10.1002/anie.201606031
PMID:27554196
Abstract

Although mesoporous metals have been synthesized by electrochemical methods, the possible compositions have been limited to noble metals (e.g., palladium, platinum, gold) and their alloys. Herein we describe the first fabrication of continuously mesoporous Cu films using polymeric micelles as soft templates to control the growth of Cu under sophisticated electrochemical conditions. Uniformly sized mesopores are evenly distributed over the entire film, and the pore walls are composed of highly crystalized Cu.

摘要

虽然已经通过电化学方法合成了介孔金属,但可能的组成仅限于贵金属(例如钯、铂、金)及其合金。在此,我们描述了首次使用聚合物胶束作为软模板,在复杂的电化学条件下控制 Cu 的生长,来制备连续介孔 Cu 薄膜。均匀尺寸的介孔均匀分布在整个薄膜上,孔壁由高度结晶的 Cu 组成。

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