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去除釉质对树脂复合材料与釉质再粘结强度的影响。

Effect of Removal of Enamel on Rebonding Strength of Resin Composite to Enamel.

作者信息

Kilponen L, Lassila L, Tolvanen M, Varrela J, Vallittu P K

机构信息

Institute of Dentistry, University of Turku, Turku, Finland.

Institute of Dentistry, University of Turku, Turku, Finland; Turku Clinical Biomaterials Centre (TCBC), Department of Biomaterials Science, Institute of Dentistry, University of Turku, Turku, Finland.

出版信息

Biomed Res Int. 2016;2016:1818939. doi: 10.1155/2016/1818939. Epub 2016 Sep 20.

DOI:10.1155/2016/1818939
PMID:27725932
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC5048044/
Abstract

. To examine the effect of removing the surface layer of enamel on the rebonding strength of resin composite. . Teeth in four groups ( = 10) were etched, a small amount of resin composite was bonded and debonded, then specimens in three groups were ground for different lengths of time (10 s, 20 s, 30 s) to remove an increasing amount of enamel, one group was left untouched. The teeth were bonded again and the bond strengths of 1st and 2nd bonding were compared and analysed against the amount of enamel loss in different groups (7 m (±2); 12 m (±1); 16 m (±3)). Specimens were examined with SEM and by noncontacting optical profilometer. . Although results indicated higher rebonding strength with increasing enamel removal ANOVA showed low statistical differences between the groups ( > 0.05). However, values between first bonding and rebonding strengths differed significantly ( < 0.05) in the group that was not ground. SEM revealed that enamel-surfaces that were ground after debonding etched well, compared to the surfaces that still contained adhesive remnants. . Removal of small amount of enamel refreshed the surface for rebonding. Rebonding strengths without grinding the surface before bonding were lower than bond strength to intact enamel.

摘要

. 为研究去除釉质表层对树脂复合材料再粘结强度的影响。. 将四组牙齿(每组n = 10)进行酸蚀处理,粘结少量树脂复合材料后再脱粘,然后对其中三组试件分别研磨不同时长(10秒、20秒、30秒)以去除不同量的釉质,一组不做处理。再次粘结牙齿,并针对不同组的釉质损失量(7μm(±2);12μm(±1);16μm(±3))比较和分析第一次和第二次粘结的粘结强度。通过扫描电子显微镜(SEM)和非接触式光学轮廓仪对试件进行检查。. 尽管结果表明随着釉质去除量增加再粘结强度更高,但方差分析显示各组之间的统计学差异较低(P>0.05)。然而,未研磨组的第一次粘结强度和再粘结强度之间的数值差异显著(P<0.05)。扫描电子显微镜显示,脱粘后研磨的釉质表面与仍含有粘结剂残余物的表面相比,酸蚀效果良好。. 去除少量釉质可使表面焕然一新以进行再粘结。粘结前未研磨表面的再粘结强度低于与完整釉质的粘结强度。

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Enamel loss following ceramic bracket debonding: A quantitative analysis in vitro.陶瓷托槽脱粘后的牙釉质损失:体外定量分析
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