Kim Jiseok, Wubs Kevin, Bae Byeong-Soo, Soo Kim Woo
Mechatronic Systems Engineering, School of Engineering Science, Simon Fraser University, Surrey, BC V3T 0A3, Canada.
Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology, Daejeon 305-701, Republic of Korea.
Sci Technol Adv Mater. 2012 Jun 13;13(3):035004. doi: 10.1088/1468-6996/13/3/035004. eCollection 2012 Jun.
Direct stamping of functional materials has been developed for cost-effective and process-effective manufacturing of nano/micro patterns. However, there remain several challenging issues like the perfect removal of the residual layer and realization of high aspect ratio. We have demonstrated facile fabrication of flexible strain sensors that have microscale thick interdigitated capacitors with no residual layer by a simple direct stamping with silver nanoparticles (AgNPs). Polyurethane (PU) prepolymer was utilized as an adhesive layer to transfer AgNPs more efficiently during the separation step of the flexible stamp from directly stamped AgNPs. Scanning electron microscopy images and energy dispersive x-ray spectroscopy analysis revealed residue-free transfer of microscale thick interdigitated electrodes onto two different flexible substrates (elastomeric and brittle) for the application to highly sensitive strain sensors.
为了以具有成本效益和工艺效益的方式制造纳米/微图案,已经开发了功能材料的直接压印技术。然而,仍然存在几个具有挑战性的问题,比如残余层的完美去除和高深宽比的实现。我们已经通过用银纳米颗粒(AgNP)进行简单的直接压印,展示了柔性应变传感器的简便制造方法——该传感器具有无微残留层的微米级厚叉指电容器。在柔性印章与直接压印的AgNP分离步骤中,聚氨酯(PU)预聚物被用作粘合剂层,以更有效地转移AgNP。扫描电子显微镜图像和能量色散X射线光谱分析表明,微米级厚的叉指电极能够无残留地转移到两种不同的柔性基板(弹性和脆性)上,用于制造高灵敏度应变传感器。