Hösel Markus, Angmo Dechan, Søndergaard Roar R, Dos Reis Benatto Gisele A, Carlé Jon E, Jørgensen Mikkel, Krebs Frederik C
Department of Energy Conversion and Storage Technical University of Denmark Frederiksborgvej 399 DK-4000 Roskilde Denmark.
Adv Sci (Weinh). 2014 Nov 22;1(1):1400002. doi: 10.1002/advs.201400002. eCollection 2014 Dec.
The fabrication of substrates and superstrates prepared by scalable roll-to-roll methods is reviewed. The substrates and superstrates that act as the flexible carrier for the processing of functional organic electronic devices are an essential component, and proposals are made about how the general availability of various forms of these materials is needed to accelerate the development of the field of organic electronics. The initial development of the replacement of indium-tin-oxide (ITO) for the flexible carrier materials is described and a description of how roll-to-roll processing development led to simplification from an initially complex make-up to higher performing materials through a more simple process is also presented. This process intensification through process simplification is viewed as a central strategy for upscaling, increasing throughput, performance, and cost reduction.
本文综述了通过可扩展的卷对卷方法制备的基底和覆盖层。作为功能性有机电子器件加工的柔性载体的基底和覆盖层是一个重要组成部分，并就如何需要这些材料的各种形式的普遍可用性以加速有机电子领域的发展提出了建议。描述了用于柔性载体材料的铟锡氧化物（ITO）替代物的初步开发，还介绍了卷对卷加工的发展如何通过更简单的工艺从最初复杂的组成简化为性能更高的材料。通过工艺简化实现的这种工艺强化被视为扩大规模、提高产量、性能和降低成本的核心策略。
