Hyk Wojciech, Kitka Konrad
Faculty of Chemistry, University of Warsaw, Pasteura 1, PL-02-093 Warsaw, Poland.
Faculty of Chemistry, University of Warsaw, Pasteura 1, PL-02-093 Warsaw, Poland.
Waste Manag. 2017 Feb;60:601-608. doi: 10.1016/j.wasman.2016.12.038. Epub 2017 Jan 3.
A system composed of persulfate salt and ammonia in highly alkaline aqueous solution is developed and examined for leaching metallic silver from elements of the electronic waste materials (e-scrap). Strong base activates persulfate ions providing in situ generation of highly reactive oxygen molecules. The oxidized metal forms then well soluble complex ions with ammonia ligands. The kinetic studies of the leaching process were performed for pure metallic silver. They revealed that the efficiency of the process is affected by the type of the persulfate salt. By employing potassium persulfate one obtains significantly (more than 50% for silver plates and more than 100% for silver powder) increased efficiency of silver dissolution compared to the solution composed of either sodium or ammonium persulfates. In the range of persulfate concentrations between 0.02 and 0.23mol/L the apparent reaction order with respect to the persulfate concentration was similar for all persulfate salts and was estimated to be around 0.5. The room temperature (22±2°C) seems to be an optimal temperature for the leaching process. An increase in the temperature resulted in the significant drop in the silver dissolution rate due to the decreased solubility of oxygen. Based on these results a possible mechanism of dissolving silver is discussed and the optimal composition of the leaching solution is formulated. The obtained formulation of the leaching solution was applied for the extraction of silver coatings of Cu-based e-waste scrap and the obtained results revealed an important effect of copper in the mechanism of the leaching process. The regression analysis of the leaching curve indicated that each gram of base-activated potassium persulfate under the specified conditions may leach almost 100mg of silver coatings in a form of well soluble diamminesilver (I) complex. The silver complex can be relatively easy reduced to metallic silver. The method developed is relatively cheap, low toxic and does not produce harmful by-products.
开发并研究了一种由过硫酸盐和氨在高碱性水溶液中组成的体系,用于从电子废料(电子垃圾)元件中浸出金属银。强碱激活过硫酸根离子,原位生成高活性氧分子。氧化后的金属随后与氨配体形成易溶的络合离子。对纯金属银进行了浸出过程的动力学研究。结果表明,该过程的效率受过硫酸盐种类的影响。与由过硫酸钠或过硫酸铵组成的溶液相比,使用过硫酸钾可显著提高银的溶解效率(银板提高超过50%,银粉提高超过100%)。在过硫酸盐浓度为0.02至0.23mol/L的范围内,所有过硫酸盐对过硫酸盐浓度的表观反应级数相似,估计约为0.5。室温(22±2°C)似乎是浸出过程的最佳温度。由于氧气溶解度降低,温度升高导致银溶解速率显著下降。基于这些结果,讨论了溶解银的可能机制,并制定了浸出溶液的最佳组成。将所得浸出溶液配方应用于铜基电子垃圾废料银涂层的提取,所得结果揭示了铜在浸出过程机制中的重要作用。浸出曲线的回归分析表明,在指定条件下,每克碱活化过硫酸钾可浸出近100mg易溶二氨合银(I)络合物形式的银涂层。银络合物可相对容易地还原为金属银。所开发的方法相对便宜、低毒且不产生有害副产物。