Smalcerz Albert, Matula Tomasz, Slusorz Michal, Wojtasik Julia, Chaberska Weronika, Kluska Szymon, Kortyka Lukasz, Mycka Lukasz, Blacha Leszek, Labaj Jerzy
Department of Industrial Informatics, Faculty of Materials Science, Silesian University of Technology, Krasinskiego 8, 40-019 Katowice, Poland.
Department of Metallurgy and Recycling, Faculty of Materials Science, Silesian University of Technology, Krasinskiego 8, 40-019 Katowice, Poland.
Materials (Basel). 2023 Jan 9;16(2):625. doi: 10.3390/ma16020625.
The article presents the results of a study on metallurgical sludge reduction using electronic waste such as Printed Circuit Boards (PCBs). Two aspects were taken into account when selecting such a reducer, namely the environmental aspect and the technological aspect. The research was an attempt to use waste metal-bearing material of which the effective management causes many problems from an environmental point of view. In the technological aspect, the specific chemical composition of this waste was taken into account. Its gasification yields significant amounts of hydrocarbons, which are excellent reducing agents in such process. The separation of these compounds may additionally cause the mixing of the molten slag, which should result in faster separation of the formed metal droplets and the molten slag. In the case of the fragmented PCB (Printed Circuit Board) reducer used in this study, a significant degree of copper removal was achieved, as much as 92%. As the reduction-process time increased, the degree of copper removal also increased. For the 1 h process, the average value of copper removal was 60%, and for the 4.5 h process it was over 70%. The case was the same with the addition of reductant: as the amount of reductant added to the process increased, an increase in copper removal was observed. With the addition of 30 g of the reducing agent (per 65 g of slag), the degree of copper removal was over 90%.
本文介绍了一项利用印刷电路板(PCBs)等电子废弃物减少冶金污泥的研究结果。选择这种还原剂时考虑了两个方面,即环境方面和技术方面。该研究试图利用含金属的废料,从环境角度来看,对其进行有效管理会引发诸多问题。在技术方面,考虑了这种废料的具体化学成分。其气化会产生大量碳氢化合物,这些碳氢化合物在该过程中是极佳的还原剂。这些化合物的分离可能还会导致熔渣混合,这应会使形成的金属液滴与熔渣更快分离。在本研究中使用的破碎印刷电路板(PCB)还原剂的情况下,实现了高达92%的显著脱铜率。随着还原过程时间的增加,脱铜率也有所提高。对于1小时的过程,脱铜的平均值为60%,而对于4.5小时的过程,该值超过70%。添加还原剂的情况也是如此:随着添加到过程中的还原剂数量增加,观察到脱铜率有所提高。添加30克还原剂(每65克炉渣)时,脱铜率超过90%。