Lu Ying, Xie Xuhui, Zhou Lin, Dai Zuocai, Chen Guiyang
Appl Opt. 2017 Jan 10;56(2):260-266. doi: 10.1364/AO.56.000260.
An ion beam with high removal rate and small diameter is expected in ion beam figuring. For an ion beam figuring tool, reducing the extraction grid opening is a feasible method to decrease the ion beam diameter, but the ion beam removal rate decreases at the same time. The ion beam removal rate depends much on the ion density in the ion source discharge room. The plasma in a hollow cathode (HC) ion source and a radio frequency (RF) ion source was simulated. The simulations suggested that the ion density in the RF ion source is higher than that of the HC one. Then, a RF ion source with an integrative matching network was developed and tested in this paper, where the ion beam removal rate reached up to 193 nm/min for 10 mm opening extraction grids.
在离子束加工中，期望获得具有高去除率和小直径的离子束。对于离子束加工工具而言，减小引出栅孔径是减小离子束直径的一种可行方法，但与此同时离子束去除率会降低。离子束去除率很大程度上取决于离子源放电室内的离子密度。对空心阴极（HC）离子源和射频（RF）离子源中的等离子体进行了模拟。模拟结果表明，RF离子源中的离子密度高于HC离子源。随后，本文研制并测试了一种带有集成匹配网络的RF离子源，对于10mm孔径的引出栅，其离子束去除率高达193nm/min。
