IEEE Trans Ultrason Ferroelectr Freq Control. 2017 Jan;64(1):93-107. doi: 10.1109/TUFFC.2016.2620425.
The microfabrication processes for sacrificial-release-based capacitive micromachined ultrasound transducer arrays are provided with an emphasis on top-orthogonal-to-bottom electrode 2-D arrays. These arrays have significant promise for high-quality 3-D imaging with reduced wiring complexity compared with fully wired arrays. The protocols and best practices are outlined in significant detail along with design considerations and notes of caution for pitfalls and factors impacting yield.
牺牲层释放型电容式微机械超声换能器阵列的微加工工艺，重点介绍了顶-底正交电极 2D 阵列。与全布线阵列相比，这种阵列具有更高质量的 3D 成像的巨大潜力，同时布线复杂度更低。本协议和最佳实践进行了详细介绍，同时还介绍了设计注意事项和陷阱及影响产量的因素注意事项。
