Katakura N, Kawakami M
Shika Rikogaku Zasshi. 1977 Apr;18(42):118-23.
The rheological properties of inlay wax were investigated by experiment of stress relaxation, thermal expansion, thermal analysis and X-ray diffraction. The results obtained were as follows. The solid-solid phase transition caused by phase transition of paraffin was observed. The stress relaxation curves of inlay wax were obtained at various temperature, and from these curves the stress relaxation master curve was composed by application of time-temperature superposition principle. The temperature dependence of sift factor was devided into two regions of Arrhenius type, and the activation energy was about 60 kcal/mol at the temperature lower than 23 degrees C and 120 kcal/mol at higher temperature. This fact suggests that the relaxation mechanism of inlay wax can be classified into two different modes. The relaxation mechanism at lower temperature region is explained by crystalline relaxation, and at higher temperature is considered to depend upon the solid-solid phase transition process of inlay wax. Calculating from the activation energy, for each 2 degrees C rise in temperature, the rate of rheological change for inlay wax is approximately two-fold at lower temperature region, and about four-fold at higher temperature region.
通过应力松弛、热膨胀、热分析及X射线衍射实验研究了嵌体蜡的流变特性。得到的结果如下。观察到由石蜡相变引起的固-固相变。在不同温度下获得了嵌体蜡的应力松弛曲线,并应用时间-温度叠加原理由这些曲线构成了应力松弛主曲线。筛因子的温度依赖性分为两个阿累尼乌斯型区域,在低于23℃的温度下活化能约为60千卡/摩尔,在较高温度下为120千卡/摩尔。这一事实表明,嵌体蜡的松弛机制可分为两种不同模式。低温区域的松弛机制用结晶松弛来解释,高温区域的松弛机制被认为取决于嵌体蜡的固-固相变过程。根据活化能计算,温度每升高2℃,嵌体蜡在低温区域的流变变化速率约为两倍,在高温区域约为四倍。