Birk-Braun Natalie, Yunus Kamran, Rees Eric J, Schabel Wilhelm, Routh Alexander F
Karlsruhe Institute of Technology, Kaiserstrasse 12, 76131 Karlsruhe, Germany.
Department of Chemical Engineering and Biotechnology, Pembroke Street, Cambridge, CB2 3RA, United Kingdom.
Phys Rev E. 2017 Feb;95(2-1):022610. doi: 10.1103/PhysRevE.95.022610. Epub 2017 Feb 27.
The fracture toughness of colloidal films is measured by characterizing cracks which form during directional drying. Images from a confocal microscope are processed to measure the crack width as a function of distance from the crack tip. Applying theory for thin elastic films the fracture toughness is extracted. It is found that the fracture toughness scales with the particle size to the -0.8 power and that the critical energy release rate scales with the particle size to the -1.3 power. In addition, the fracture toughness is found to increase at lower evaporation rates, but the film thickness does not have a significant effect.
通过对定向干燥过程中形成的裂纹进行表征来测量胶体薄膜的断裂韧性。对共聚焦显微镜拍摄的图像进行处理，以测量裂纹宽度与距裂纹尖端距离的函数关系。应用薄弹性薄膜理论提取断裂韧性。研究发现，断裂韧性与粒径的-0.8次方成比例，临界能量释放率与粒径的-1.3次方成比例。此外，还发现断裂韧性在较低蒸发速率下会增加，但薄膜厚度没有显著影响。
