Zintler A, Kunz U, Pivak Y, Sharath S U, Vogel S, Hildebrandt E, Kleebe H-J, Alff L, Molina-Luna L
Technische Universität Darmstadt, Department of Material- and Geosciences, Alarich-Weiss-Strasse 2, 64287 Darmstadt, Germany.
DENSsolutions, Informaticalaan 12, 2628ZD, Delft, Netherlands.
Ultramicroscopy. 2017 Oct;181:144-149. doi: 10.1016/j.ultramic.2017.04.008. Epub 2017 Apr 21.
Recent advances in microelectromechanical systems (MEMS) based chips for in situ transmission electron microscopy are opening exciting new avenues in nanoscale research. The capability to perform current-voltage measurements while simultaneously analyzing the corresponding structural, chemical or even electronic structure changes during device operation would be a major breakthrough in the field of nanoelectronics. In this work we demonstrate for the first time how to electrically contact and operate a lamella cut from a resistive random access memory (RRAM) device based on a Pt/HfO/TiN metal-insulator-metal (MIM) structure. The device was fabricated using a focused ion beam (FIB) instrument and an in situ lift-out system. The electrical switching characteristics of the electron-transparent lamella were comparable to a conventional reference device. The lamella structure was initially found to be in a low resistance state and could be reset progressively to higher resistance states by increasing the positive bias applied to the Pt anode. This could be followed up with unipolar set/reset operations where the current compliance during set was limited to 400 µA. FIB structures allowing to operate and at the same time characterize electronic devices will be an important tool to improve RRAM device performance based on a microstructural understanding of the switching mechanism.
基于微机电系统(MEMS)的原位透射电子显微镜芯片的最新进展为纳米级研究开辟了令人兴奋的新途径。在器件运行过程中同时进行电流-电压测量并分析相应的结构、化学甚至电子结构变化的能力将是纳米电子学领域的一项重大突破。在这项工作中,我们首次展示了如何对基于Pt/HfO/TiN金属-绝缘体-金属(MIM)结构的电阻式随机存取存储器(RRAM)器件切割得到的薄片进行电接触和操作。该器件是使用聚焦离子束(FIB)仪器和原位剥离系统制造的。电子透明薄片的电开关特性与传统参考器件相当。最初发现薄片结构处于低电阻状态,通过增加施加到Pt阳极的正偏压可以逐渐将其重置为更高的电阻状态。这可以通过单极设置/重置操作进行跟进,其中设置期间的电流合规性限制为400 µA。能够操作并同时表征电子器件的FIB结构将是基于对开关机制的微观结构理解来提高RRAM器件性能的重要工具。